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Amphenol Communications Solutions |
Part No. |
10077239-116LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-140LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 40 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Agilent / Hewlett-Packard
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Part No. |
HCPL-3101 HCPL-3100
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Description |
Power MOSFET/IGBT Gate Drive Optocouplers(功率 MOSFET/IGBT门驱动耦合 功率MOSFET / IGBT栅极驱动光电耦合器(功率MOSFET IGBT的门驱动耦合器) Power MOSFET-IGBT Gate Drive Optocouplers
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File Size |
256.32K /
12 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10077239-416LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-108LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 8 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-164LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 64 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-420LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 20 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-214LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-118LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 18 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-120LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10077239-106TLF
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Description |
BergStik®, Board to Board connector, Unshrouded header, Press Fit, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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TECHNOLOGY
(CHINA HK & SZ)
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Part: HCPL-7720 |
Maker: AGILENT |
Pack: DIP-8 |
Stock: 273 |
Unit price
for : |
50: $3.14 |
100: $2.98 |
1000:
$2.82 |
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