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For binding Found Datasheets File :: 5860 Search Time::7.703ms
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				CML INNOVATIVE TECHNOLOGIES
Part No.	19092357
OCR Text	...ion include in datasheet is not binding. part number : 19092357 serial number : 1905 leds indicators lum in type (dc) 600mcd voltage tolerance (%) 10% op. temperature (c) -25c...+60c storage temperature (c) -25c...+60c narrative viewing ...
Description	SINGLE COLOR LED, BLUE, 5 mm
File Size	123.71K / 2 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	TDA8011 TDA8011T
OCR Text	...fine solder particles, flux and binding agent) to be DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA8011T applied to the substrate by screen printing, stencilling...
Description	IF amplifier for satellite TV receivers
File Size	74.46K / 12 Page	View it Online	Download Datasheet

				Philips
Part No.	TDA7010T TDA7010T_CNV_2 TDA7010T/V3
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal ...
Description	TDA7010T; FM radio circuit From old datasheet system
File Size	176.06K / 11 Page	View it Online	Download Datasheet

				Philips
Part No.	74HC109N 74HC109D 74HC109DB 74HCT109N 74HCT109PW 74HCT109DB
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal ...
Description	74HC/HCT109; Dual JK flip-flop with set and reset; positive-edge trigger
File Size	55.36K / 9 Page	View it Online	Download Datasheet

				Cirrus Logic
Part No.	CDB61310 CS61310EB
OCR Text	...d-pair T1 long haul operations. binding posts and bantam jacks are provided for the line interface connections. Several BNC connectors provide clock and data I/O at the system interface. Reference timing may be derived from a quartz crystal...
Description	From old datasheet system
File Size	965.83K / 14 Page	View it Online	Download Datasheet

				Philips
Part No.	CGY2020G
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal ...
Description	DCS 2 W power amplifier
File Size	72.02K / 12 Page	View it Online	Download Datasheet

				Advantech Co., Ltd.
Part No.	EKI-2748FI EKI-2748FI-14
OCR Text	...rity, dhcp server, port and ip binding, 802.1x port access control, ssl ? traffc control igmp snooping/query for multicast group management, port trunking, static/802.3ad, lacp rate limit and storm control, ieee 802.1p qos cos/tos/ ...
Description	4Gx 4SFP Managed Ethernet Switch with Wide Temperature
File Size	417.98K / 2 Page	View it Online	Download Datasheet

				EPCOS
Part No.	T57
OCR Text	...d/or core size in question are binding. effects of core combination on a l value stresses in the core affect not only the mechanica l but also the magnetic properties. it is apparent that the initial permeability is dependent on the str...
Description	Ferrites and accessories
File Size	164.70K / 6 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	SAB6456 SAB6456T
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. SAB6456 SAB6456T Several techniques exist for reflowing...
Description	Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:10-13 Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler
File Size	77.51K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. Philips Semiconductors
Part No.	TDA1575T TDA1575
OCR Text	...fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal ...
Description	FM front end circuit for CENELEC EN 55020 applications
File Size	186.38K / 16 Page	View it Online	Download Datasheet

For binding Found Datasheets File :: 5860 Search Time::7.703ms
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