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  87760-1236 Datasheet PDF File

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    0877600626 87760-0626

Molex Electronics Ltd.
Part No. 0877600626 87760-0626
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray, Lead-free

File Size 155.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 78511-236HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0877600617 87760-0617

Molex Electronics Ltd.
Part No. 0877600617 87760-0617
Description 2.00mm (.079 0.76渭m (30渭") Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 154.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 50295-1236ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, 4 Row, 0 Guide Pin, Through Hole, 236 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0877600417 87760-0417

Molex Electronics Ltd.
Part No. 0877600417 87760-0417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 154.96K  /  4 Page

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Amphenol Communications Solutions

Part No. 78511-236
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0877600416 87760-0416

Molex Electronics Ltd.
Part No. 0877600416 87760-0416
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 155.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 68461-236HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877600616 87760-0616

Molex Electronics Ltd.
Part No. 0877600616 87760-0616
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
MOLEX Connector

File Size 155.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-112362500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877601016 87760-1016

Molex Electronics Ltd.
Part No. 0877601016 87760-1016
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.54K  /  4 Page

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Amphenol Communications Solutions

Part No. 50015-1236JLF
Description High Pin Count, Backplane Connectors, Header, Vertical, 4 Row, 0 Guide Pin, Through Hole, 236 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0877601017 87760-1017

Molex Electronics Ltd.
Part No. 0877601017 87760-1017
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.37K  /  4 Page

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Amphenol Communications Solutions

Part No. 68771-236H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0877600838 87760-0838

Molex Electronics Ltd.
Part No. 0877600838 87760-0838
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 8 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-f

File Size 155.18K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-123600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

    VSC1235 VSC1236

Vitesse Semiconductor Corporation
Part No. VSC1235 VSC1236
Description 9.9 to 12.5 Gbps 16:1 Multiplexer with Clock Multiplier Unit and Demultiplexer with Clock Recovery Chip Set

File Size 416.61K  /  2 Page

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Amphenol Communications Solutions

Part No. 68691-236HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Vitesse Semiconductor Corporation.
Part No. VSC1236 VSC1235
Description 9.9 to 12.5 Gbps 16:1 Multiplexer with Clock Multiplier Unit and Demultiplexer with Clock Recovery Chip Set

File Size 411.62K  /  2 Page

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Amphenol Communications Solutions

Part No. 10118066-1236010LF
Description RJ45 Modular Jack Connector, Input Output Connectors, Cat 3, Horizontal, Through Mount, shielded, Snap Peg, 8 Positions, 2 Ports.
Tech specs    

Official Product Page

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