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  87759-4251 Datasheet PDF File

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    87759-1465

Molex Electronics Ltd.
Part No. 87759-1465
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.39K  /  6 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

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HUA FENG CIRCUIT





    87759-3876

Molex Electronics Ltd.
Part No. 87759-3876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    87759-4876

Molex Electronics Ltd.
Part No. 87759-4876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-1464

Molex Electronics Ltd.
Part No. 87759-1464
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 421.26K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-0876

Molex Electronics Ltd.
Part No. 87759-0876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 79425-140HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-4276

Molex Electronics Ltd.
Part No. 87759-4276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 79425-160HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free
File Size 174.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 10128425-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, Right Guide Pin.
Tech specs 　 　

Official Product Page

    87759-1475

Molex Electronics Ltd.
Part No. 87759-1475
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.41K  /  6 Page

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Amphenol Communications Solutions
Part No. 59112-G34-25-111LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
Tech specs 　 　

Official Product Page

    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 420.97K  /  8 Page

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Amphenol Communications Solutions
Part No. 10034251-101LF
Description AirMax VS®, Backplane Connectors, Receptacle, Vertical, Press-Fit, 3 Pair, 10 Column, 90 Position, 2.00mm (0.079in) Pitch
Tech specs 　 　

Official Product Page

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap
File Size 421.28K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

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