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Texas Instruments |
| Part No. |
5962-8775801RA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-87758012A
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-LCCC -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801SA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8775801VSA
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| Description |
Octal Bus Transceivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54201-G0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54102-T0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-111081700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877580816 87758-0816
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.91K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-109081700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-S0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877584816 87758-4816
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 48 Circuits, 0.38μm(15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
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| File Size |
170.71K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
57102-G08-17ULF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
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Official Product Page
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Price and Availability
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