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  85048-0567 Datasheet PDF File

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    15-80-0107 0015800107 A-70567-0207

Molex Electronics Ltd.
Part No. 15-80-0107 0015800107 A-70567-0207
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

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Amphenol Communications Solutions

Part No. 10130567-101LF
Description AirMax VS2®, Backplane Connectors, 4-Pair, 72 -position, pitch, 6 column, Right Angle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800209 15-80-0209 A-70567-0280

Molex Electronics Ltd.
Part No. 0015800209 15-80-0209 A-70567-0280
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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    A-70567-0343 15-80-1101 0015801101

Molex Electronics Ltd.
Part No. A-70567-0343 15-80-1101 0015801101
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    0015800683 A-70567-0100 15-80-0683

Molex Electronics Ltd.
Part No. 0015800683 A-70567-0100 15-80-0683
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    A-70567-0285 15-80-0309 0015800309

Molex Electronics Ltd.
Part No. A-70567-0285 15-80-0309 0015800309
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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    A-70567-0215 0015800267

Molex Electronics Ltd.
Part No. A-70567-0215 0015800267
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits

File Size 1,218.31K  /  7 Page

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    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    A-70567-0282 0015800249

Molex Electronics Ltd.
Part No. A-70567-0282 0015800249
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    A-70567-0281 0015800229

Molex Electronics Ltd.
Part No. A-70567-0281 0015800229
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    A-70567-0102 0015800723

Molex Electronics Ltd.
Part No. A-70567-0102 0015800723
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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