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Amphenol Communications Solutions |
| Part No. |
68464-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
72443-205LF
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| Description |
Vertical Receptacle 40 Position, 1.27mm x 1.27mm (0.05inch x 0.05inch) Centerline, Lead-Free Gold Flash, Terminal Length 3.79, with Peg, customized radius
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0444321003 44432-1003
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
224.13K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-327-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10124432-101LF
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| Description |
AirMax VSe® High-Speed Backplane Connector, Backplane Connectors, , 3-Pair, 10 Column, 90-Position, 2.0mm, Right Angle Receptacle, Press-Fit.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68604-432HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
55443-204LF
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| Description |
5 Row Signal Header, Straight, Solder-to-Board
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-327-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
44432-1801 0444321801
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
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| File Size |
224.08K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68024-432HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 3.81 mm (0.15in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJMG226K34432ER
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| Description |
RJMG 2x6 1000 base-T, with led
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-320-22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Bom2Buy.com
Price and Availability
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