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  2808 Datasheet PDF File

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    0444280805 44428-0805

Molex Electronics Ltd.
Part No. 0444280805 44428-0805
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-808081200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0444280803 44428-0803

Molex Electronics Ltd.
Part No. 0444280803 44428-0803
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.75K  /  4 Page

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Amphenol Communications Solutions

Part No. 54242-808081350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung
Part No. K9F2808U0C
Description IC,EEPROM,NAND FLASH,16MX8,CMOS,TSSOP,48PIN,PLASTIC
From old datasheet system

File Size 317.17K  /  32 Page

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Amphenol Communications Solutions

Part No. 77315-128-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0528081570

Molex Electronics Ltd.
Part No. 0528081570
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 15Circuits, Lead-free

File Size 553.08K  /  10 Page

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Amphenol Communications Solutions

Part No. 54122-808100950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    52808-1970 0528081970

Molex Electronics Ltd.
http://
Part No. 52808-1970 0528081970
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 19Circuits, Lead-free

File Size 553.08K  /  10 Page

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Amphenol Communications Solutions

Part No. 54122-808641400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K9S2808V0B
Description 16M x 8Bit SmartMedia Card Data Sheet

File Size 348.08K  /  26 Page

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Amphenol Communications Solutions

Part No. 59202-F28-08U050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs    

Official Product Page

    52808-3070 0528083070

Molex Electronics Ltd.
Part No. 52808-3070 0528083070
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 30Circuits, Lead-free

File Size 552.82K  /  10 Page

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Amphenol Communications Solutions

Part No. 59132-T28-08-037LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K9S2808V0A
Description 16M x 8Bit SmartMedia Card Data Sheet

File Size 348.18K  /  26 Page

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Amphenol Communications Solutions

Part No. 54242-808161450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0528082270

Molex Electronics Ltd.
Part No. 0528082270
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, Non-ZIF Receptacle, 22Circuits, Lead-free

File Size 553.08K  /  10 Page

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Amphenol Communications Solutions

Part No. 54242-808202350LF
Description BERGSTIK STACKING
Tech specs    

Official Product Page

    2280842400

Meder Electronic
Part No. 2280842400
Description Reed Switch

File Size 318.23K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-808201650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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Part: 2800
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