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    HYNIX SEMICONDUCTOR INC
Part No. HY27SA081G1M-VPEB HY27SA081G1M-VPIP
OCR Text ...pplications nand interface - x8 or x16 bus width. - multiplexed address/ data - pinout compatibility for all densities supply voltage - 3.3v device: vcc = 2.7 to 3.6v : hy27uaxx1g1m - 1.8v device: vcc = 1.7 to 1.95v : hy27sax...
Description 128M X 8 FLASH 1.8V PROM, 12000 ns, PDSO48

File Size 678.08K  /  45 Page

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    MT47H64M16HR-25ELH

Micron Technology
Part No. MT47H64M16HR-25ELH
OCR Text ...output strobe (rdqs) option for x8 ? dll to align dq and dqs transitions with ck ? 8 internal banks for concurrent operation ? programmable ...x16 C 84-ball fbga (8mm x 12.5mm) hr ? fbga package (pb-free) C x4, x8 C 60-ball fbga (8mm x 10m...
Description 1Gb: x4, x8, x16 DDR2 SDRAM

File Size 2,100.02K  /  132 Page

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    PA28F200BL-B150 PA28F200BL-T150 E28F002BL-B150 E28F002BL-T150 28F200BL-TB E28F200BL-B150 E28F200BL-T150

INTEL[Intel Corporation]
Part No. PA28F200BL-B150 PA28F200BL-T150 E28F002BL-B150 E28F002BL-T150 28F200BL-TB E28F200BL-B150 E28F200BL-T150
OCR Text ...perature Range b 20 C to a 70 C x8 x16 Input Output Architecture 28F200BL-T 28F200BL-B For High Performance and High Integration 16-bit and 32-bit CPUs x8-only Input Output Architecture 28F002BL-T 28F002BL-B For Space Constrained 8-bit Appl...
Description 2-MBIT (128K x 16/ 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY
2-MBIT (128K x 16, 256K x 8)LOW-POWER BOOT BLOCK FLASH MEMORY FAMILY

File Size 486.61K  /  42 Page

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    PROMOS TECHNOLOGIES INC
Part No. V59C1256804QALP19E V59C1256808QALP19E V59C1G01164QALF37E
OCR Text ...d data strobe (rdqs) supported (x8 only) differential clock inputs ck and ck jedec power supply 1.8v 0.1v vddq=1.8v 0.1v available in 68-ball fbga for x4 and x8 component or 92-ball fbga for x16 component rohs compliant pasr parti...
Description 32M X 8 DDR DRAM, BGA68
64M X 16 DDR DRAM, BGA92

File Size 1,035.33K  /  79 Page

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    PA28F200BX-B120 PA28F200BX-B60 PA28F200BX-B80 PA28F200BX-T120 PA28F200BX-T60 PA28F200BX-T80 TB28F200BX TB28F200BX-B80 TB

INTEL[Intel Corporation]
Part No. PA28F200BX-B120 PA28F200BX-B60 PA28F200BX-B80 PA28F200BX-T120 PA28F200BX-T60 PA28F200BX-T80 TB28F200BX TB28F200BX-B80 TB28F200BX-T80 TE28F200BX-B80 TE28F200BX-T80 TE28F002BX-B80 TE28F002BX-T80 E28F200BX-T60 28F200BX 28F200BX-TB E28F002BX-B120 E28F002BX-B60 E28F002BX-B80 E28F002BX-T120 E28F002BX-T60 E28F002BX-T80 E28F200BX-B120 E28F200BX-B60 E28F200BX-B80 E28F200BX-T120 E28F200BX-T80
OCR Text x8 x16 Input Output Architecture 28F200BX-T 28F200BX-B For High Performance and High Integration 16-bit and 32-bit CPUs x8-only Input Output Architecture 28F002BX-T 28F002BX-B For Space Constrained 8-bit Applications Upgradeable to Intel's ...
Description 2-MBIT (128K x 16/ 256K x 8) BOOT BLOCK FLASH MEMORY FAMILY
2-MBIT (128K x 16, 256K x 8) BOOT BLOCK FLASH MEMORY FAMILY

File Size 552.17K  /  48 Page

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    ST93C46A ST93C46AB1013TR ST93C46AB1TR ST93C46AB3013TR ST93C46AB3TR ST93C46AB6013TR ST93C46AB6TR ST93C46AM1013TR ST93C46A

SGS Thomson Microelectronics
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
STMicroelectronics N.V.
Part No. ST93C46A ST93C46AB1013TR ST93C46AB1TR ST93C46AB3013TR ST93C46AB3TR ST93C46AB6013TR ST93C46AB6TR ST93C46AM1013TR ST93C46AM1TR ST93C46AM3013TR ST93C46AM3TR ST93C46AM6013TR ST93C46AM6TR ST93C46C ST93C46CB1013TR ST93C46CB1TR ST93C46CB3013TR ST93C46CB3TR ST93C46CB6013TR ST93C46CB6TR ST93C46CM1013TR ST93C46CM1TR ST93C46CM3013TR ST93C46CM3TR ST93C46CM6013TR ST93C46CM6TR ST93C46T ST93C46TB1013TR ST93C46TB1TR ST93C46TB3013TR ST93C46TB3TR ST93C46TB6013TR ST93C46TB6TR ST93C46TM1013TR ST93C46TM1TR ST93C46TM3013TR ST93C46TM3TR ST93C46TM6013TR ST93C46TM6TR ST93C47AB1013TR ST93C47AB1TR ST93C47AB3013TR ST93C47AB3TR ST93C47AB6013TR ST93C47AB6TR ST93C47AM1013TR ST93C47AM1TR ST93C47AM3013TR ST93C47AM3TR ST93C47AM6013TR ST93C47AM6TR ST93C47C ST93C47CB1013TR ST93C47CB1TR ST93C47CB3013TR ST93C47CB3TR ST93C47CB6013TR ST93C47CB6TR ST93C47CM1013TR ST93C47CM1TR ST93C47CM3013TR ST93C47CM3TR ST93C47CM6013TR ST93C47CM6TR ST93C47T ST93C47TB1013TR ST93C47TB1TR ST93C47TB3013TR ST93C47TB3TR ST93C47TB6013TR ST93C47TB6TR ST93C47TM1013TR ST93C47TM1TR ST93C47TM3013TR ST93C47TM3TR ST93C47TM6013TR ST93C47TM6TR ST93C46CM1 2442 ST93C46 -ST93C47AB3013TR -ST93C46CM1 -ST93C46CM1013TR
OCR Text ...s connected to Ground (VSS) the x8 organization is selected. When the ST93C46 is in standby mode, the ORG input should be unconnected or set...x16 organization or seven bits for the x8 organization. Table 6. Instruction Set Instruction READ W...
Description From old datasheet system
1K (64 x 16 or 128 x 8) SERIAL MICROWIRE EEPROM
MOSFET; Drain Source Voltage, Vds:30V; Continuous Drain Current, Id:3.4A; On-Resistance, Rds(on):0.085ohm; Rds(on) Test Voltage, Vgs:10V; Leaded Process Compatible:Yes; Mounting Type:Surface Mount; Package/Case:6-TSOP RoHS Compliant: Yes
MOSFET; Transistor Polarity:P Channel; Drain Source Voltage, Vds:-12V; Continuous Drain Current, Id:-4.5A; On-Resistance, Rds(on):0.04ohm; Rds(on) Test Voltage, Vgs:-4.5V; Package/Case:6-TSOP; Leaded Process Compatible:No
MOSFET, P TSOP-6MOSFET, P TSOP-6; Transistor type:MOSFET; Transistor polarity:P; Voltage, Vds max:12V; Case style:TSOP-6; Current, Id cont:4.5A; Current, Idm pulse:20A; Power, Pd:1.1W; Resistance, Rds on:0.04R; SMD:1; Charge, Qrr typ
Circular Connector; No. of Contacts:13; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:10-13
Circular Connector; No. of Contacts:13; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:10; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:10-13
1K 64 x 16 or 128 x 8 SERIAL MICROWIRE EEPROM 000 64 x 1628 × 8 MICROWIRE的串行EEPROM
1K 64 x 16 or 128 x 8 SERIAL MICROWIRE EEPROM 000 64 x 16128 × 8 MICROWIRE的串行EEPROM

File Size 109.99K  /  13 Page

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    H5TQ8G63AMR-PBC H5TQ8G63AMR-RDC H5TQ8G63AMR-G7C H5TQ8G63AMR-H9C H5TQ8G43AMR H5TQ8G43AMR-H9C

Hynix Semiconductor
Part No. H5TQ8G63AMR-PBC H5TQ8G63AMR-RDC H5TQ8G63AMR-G7C H5TQ8G63AMR-H9C H5TQ8G43AMR H5TQ8G43AMR-H9C
OCR Text ... jedec standard 78ball fbga(x4/x8), 96ball fbga(x16 ? driver strength selected by emrs ? dynamic on die termination supported ? asynchronous reset pin supported ? zq calibration supported ? tdqs (termination data strobe) supp...
Description 8Gb DDR3 SDRAM

File Size 406.56K  /  35 Page

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    AS4LC4M16S0 AS4LC4M16S0-10FTC AS4LC4M16S0-10TC AS4LC4M16S0-75TC AS4LC4M16S0-8TC AS4LC8M8S0 AS4LC8M8S0-10FTC AS4LC8M8S0-1

ALSC[Alliance Semiconductor Corporation]
ETC
Part No. AS4LC4M16S0 AS4LC4M16S0-10FTC AS4LC4M16S0-10TC AS4LC4M16S0-75TC AS4LC4M16S0-8TC AS4LC8M8S0 AS4LC8M8S0-10FTC AS4LC8M8S0-10TC AS4LC8M8S0-75TC AS4LC8M8S0-8TC
OCR Text ...CLK, CKE, UDQM/LDQM (x16), DQM (x8). Row and column addresses are multiplexed. Row address: A0~A11. Column address (8Mx8): A0~A8. Column address (4Mx16): A0~A7. Memory cell array is organized in 4 banks. BA0 and BA1 select which internal ba...
Description 3.3V 4Mx16 and 8Mx8 CMOS synchronous DRAM

File Size 387.58K  /  24 Page

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    K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S28163

Samsung Electronic
Samsung semiconductor
Part No. K4S280832E-TC75 K4S280832E-TL75 K4S281632E-TC60 K4S281632E-TC75 K4S281632E-TL60 K4S281632E-TL75 K4S281632F-TC60 K4S281632F-TC75 K4S281632F-TL60 K4S281632F-TL75 K4S280432E-TC75 K4S280432E-TL75
OCR Text x8, x16) CMOS SDRAM 128Mb E-die SDRAM Specification Revision 1.2 May. 2003 * Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.2 May. 2003 SDRAM 128Mb E-die (x4, x8, x16) Re...
Description 128Mb F-die SDRAM Specification
128Mb E-die SDRAM Specification

File Size 142.11K  /  14 Page

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