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  TEL2-0521 Datasheet PDF File

For TEL2-0521 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0521510210 52151-0210

Molex Electronics Ltd.
Part No. 0521510210 52151-0210
Description 2.00mm (.079") Pitch Wire Trap, Pull-Cover Style, Right Angle, 2 Circuits
2.00mm (.079) Pitch Wire Trap, Pull-Cover Style, Right Angle, 2 Circuits
File Size 113.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 10136647-052141LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    52151-0610 0521510610

Molex Electronics Ltd.
Part No. 52151-0610 0521510610
Description 2.00mm (.079") Pitch Wire Trap, Pull-Cover Style, Right Angle, 6 Circuits
2.00mm (.079) Pitch Wire Trap, Pull-Cover Style, Right Angle, 6 Circuits
File Size 113.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 10137785-052142LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs 　 　

Official Product Page

    0521510410

Molex Electronics Ltd.
Part No. 0521510410
Description 2.00mm (.079") Pitch Wire Trap, Pull-Cover Style, Right Angle, 4 Circuits
File Size 113.84K  /  3 Page

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Amphenol Communications Solutions
Part No. 10136656-0521LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Gold Flash plating, 5 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    0521470410 52147-0410

Molex Electronics Ltd.
Part No. 0521470410 52147-0410
Description 2.00mm (.079") Pitch Wire Trap, Pull-Cover Style, Vertical, 4 Circuits
2.00mm (.079) Pitch Wire Trap, Pull-Cover Style, Vertical, 4 Circuits
File Size 112.70K  /  3 Page

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Amphenol Communications Solutions
Part No. 87052-120HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0521170413 52117-0413

Molex Electronics Ltd.
Part No. 0521170413 52117-0413
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits, WideBody Type
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 2 Circuits, WideBody Type
File Size 98.10K  /  2 Page

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Amphenol Communications Solutions
Part No. 87052-142HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0521170411 52117-0411

Molex Electronics Ltd.
Part No. 0521170411 52117-0411
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 4 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 4 Circuits
File Size 98.33K  /  2 Page

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Amphenol Communications Solutions
Part No. 87052-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    0521170410 52117-0410

Molex Electronics Ltd.
Part No. 0521170410 52117-0410
Description 2.00mm (.079) Pitch, Milli-Grid Crimp Housing, 12 Circuits, without CenterPolarization Key, without Locking Ramp, Leadfree
File Size 98.33K  /  2 Page

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Amphenol Communications Solutions
Part No. 10132798-052110LF
Description BergStak® 0.5mm Mezzanine Connector, Board To Board Connectors, 50 position, 2.7mm height receptacle connector.
Tech specs 　 　

Official Product Page

    0521170342 52117-0342

Molex Electronics Ltd.
Part No. 0521170342 52117-0342
Description 2.50mm (.098") Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
2.50mm (.098) Pitch Splash Proof Wire-to-Wire Receptacle Housing, 3 Circuits
File Size 115.67K  /  3 Page

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Amphenol Communications Solutions
Part No. 10136646-05214LF
Description Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    TC7S66F TC7S66FU E005214

Toshiba Semiconductor
Part No. TC7S66F TC7S66FU E005214
Description From old datasheet system
BILATERAL SWITCH
File Size 243.07K  /  6 Page

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Amphenol Communications Solutions
Part No. 87052-118HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    1061052100

Molex Electronics Ltd.
Part No. 1061052100
Description    HBMT High Density Backplane Daughtercard Connector Housing
File Size 33.26K  /  1 Page

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Amphenol Communications Solutions
Part No. 87052-140HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

For TEL2-0521 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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