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L15PF EGL34A 10560 B86612P 625ETT MAX2036 1206L C506BX
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  syringe Datasheet PDF File

For syringe Found Datasheets File :: 119    Search Time::1.828ms    
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    TDA7010T TDA7010

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NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA7010T TDA7010
OCR Text ...inting, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Ty...
Description FM radio circuit

File Size 181.91K  /  11 Page

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    TDA7088T TDA7088

PHILIPS[Philips Semiconductors]
Part No. TDA7088T TDA7088
OCR Text ...inting, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Ty...
Description FM receiver circuit for battery supply

File Size 159.96K  /  16 Page

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    Ablestik
ETC[ETC]
Part No. 2815A
OCR Text ...lly while thawing. Refer to the syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to ope...
Description THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE

File Size 317.05K  /  3 Page

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    74AUC1G00GW 74AUC1G00 74AUC1G00GV

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AUC1G00GW 74AUC1G00 74AUC1G00GV
OCR Text ...inting, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and co...
Description Single 2-input NAND gate
From old datasheet system

File Size 50.12K  /  12 Page

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    74HC1GU04GW 74HC1GU04

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74HC1GU04GW 74HC1GU04
OCR Text ...inting, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary be...
Description Inverter

File Size 116.68K  /  16 Page

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    74HC7014N 74HC7014 74HC7014D

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74HC7014N 74HC7014 74HC7014D
OCR Text ...inting, stencilling or pressure-syringe dispensing before package placement. 74HC7014 Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on hea...
Description Hex non-inverting precision Schmitt-trigger

File Size 61.19K  /  9 Page

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    TDA1308T TDA1308

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA1308T TDA1308
OCR Text ...creen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4...
Description Class AB stereo headphone driver

File Size 107.13K  /  12 Page

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    84-1LMISR4

List of Unclassifed Manufacturers
ETC
Part No. 84-1LMISR4
OCR Text ...lly while thawing. Refer to the syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to ope...
Description ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

File Size 367.96K  /  3 Page

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    ATM-0007 ATM-0018 ATM-0020 ATM-0031 ATM-0052 ATM-0055 ATM-0059 ATM-0068 ATM-0073 ATM-0087 ATM-0089 ATM-0093 ATM-0112 ATM

List of Unclassifed Manufacturers
ETC
Part No. ATM-0007 ATM-0018 ATM-0020 ATM-0031 ATM-0052 ATM-0055 ATM-0059 ATM-0068 ATM-0073 ATM-0087 ATM-0089 ATM-0093 ATM-0112 ATM-0116
OCR Text ...tically while thawing. Refer to syringe Thaw Time chart for the thaw time recommendation. DO NOT open the container before contents reach ambient temperature. Any moisture that collects on the thawed container should be removed prior to ope...
Description ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE

File Size 328.26K  /  3 Page

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For syringe Found Datasheets File :: 119    Search Time::1.828ms    
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