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Avantics
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Part No. |
AX358S
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OCR Text |
...terial: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 dim min. max. a 6.29 6.40 b 9.22 9.32 c-*1.52 d-*1.27 e-*0.99 f 3.25 3.... |
Description |
Low Power Dual Operational Amplifiers
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File Size |
231.21K /
7 Page |
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it Online |
Download Datasheet |
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HSMC[Hi-Sincerity Mocroelectronics]
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Part No. |
H50N03J
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OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C F G H L M N a1 a2 a5
Min. 6.35 4.80 1.30 5.40 2.20 0.40 2.... |
Description |
N-Channel Enhancement-Mode MOSFET (25V, 50A)
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File Size |
60.31K /
5 Page |
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it Online |
Download Datasheet |
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Orister
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Part No. |
AX1509
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OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
*: Typical, Unit: mm
I
8-Lead DIP-8 Plastic Package Package Cod... |
Description |
2A PWM Buck DC/DC Converter
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File Size |
241.83K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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