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Molex Electronics Ltd.
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| Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.41K /
7 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0015800281 70567-0012 15-80-0281
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
87891-0408
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| Description |
2.54mm (.100) Pitch KK庐 header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
287.76K /
5 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
36511-0169 MM-B1440-R963 0365110169
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| Description |
2.54mm (.100) Pitch DIN 41612 header, Style R, Through Hole, Vertical, 1.10μm (43μ) Gold (Au) Plating, Tail Length 13.00mm (.512), 64 Circuits
2.54mm (.100") Pitch DIN 41612 header, Style R, Through Hole, Vertical, 1.10渭m (43渭") Gold (Au) Plating, Tail Length 13.00mm (.512"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 header, Style R, Through Hole, Vertical, 1.10楼矛m (43楼矛") Gold (Au) Plating, Tail Length 13.00mm (.512"), 64 Circuits
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| File Size |
183.18K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
36511-0122 0365110122 MMB1502R963 MM-B1502-R963
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| Description |
2.54mm (.100) Pitch DIN 41612 header, Style R, Through Hole, Vertical, 0.60μm (24μ) Gold (Au) Plating, Tail Length 4.50mm (.177), 64 Circuits
2.54mm (.100") Pitch DIN 41612 header, Style R, Through Hole, Vertical, 0.60渭m (24渭") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 header, Style R, Through Hole, Vertical, 0.60楼矛m (24楼矛") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
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| File Size |
205.02K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0850031378 85003-1378
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| Description |
2.54mm (.100) Pitch DIN 41612 C/3 Style Male header, Right Angle, Through Hole, 1.27μm (50μ) Selective Gold (Au) Plating, 30 Circuits, without Mounting Clips
2.54mm (.100) Pitch DIN 41612 C/3 Style Male header, Right Angle, Through Hole, 1.27渭m (50渭) Selective Gold (Au) Plating, 30 Circuits, without Mounting Clips
2.54mm (.100) Pitch DIN 41612 C/3 Style Male header, Right Angle, Through Hole, 1.27楼矛m (50楼矛) Selective Gold (Au) Plating, 30 Circuits, without Mounting Clips
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| File Size |
56.03K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0085 0015800085 A-70567-0138
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
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| File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0083 0015800083
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
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| File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0089 0015800089 A-70567-0274
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
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| File Size |
1,218.52K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0123 0015800123
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| Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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