GDM-8246 pdf Datasheet P8 Part Num --- IC-ON-LINE


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GDM-8246 Datasheet PDF File

For GDM-8246 Found Datasheets File :: 111+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 |

					Hynix Semiconductor, Inc.
Part No.	HY27UH088GDM-MPEB HY27UH088G2M-TIS HY27UH088G2M-TIB HY27UH088G2M-TIP
Description	1G X 8 FLASH 3.3V PROM, 30 ns, PBGA52 12 X 17 MM, 1 MM HEIGHT, LEAD FREE, TLGA-52 1G X 8 FLASH 3.3V PROM, 30 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
File Size	445.48K / 53 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE4A1882461
Description	Modular Jacks, Input Output Connectors 8P8C, Vertical, CAT6A, Shield, With LEDs
Tech specs				Official Product Page

HUA FENG CIRCUIT

					EPCOS AG EPCOS[EPCOS]
Part No.	B82464-A4152-M B82464-A4222-M B82464-A4684-K B82464-A4 B82464-A4102-M B82464-A4103-M B82464-A4104-K B82464-A4105-K B82464-A4153-K B82464-A4154-K B82464-A4223-K B82464-A4224-K B82464-A4333-K B82464-A4362-M B82464-A4472-M B82464-A4473-K B82464-A4474-K B82464-A4682-M B82464-A4683-K B82464-A4334-K
Description	1 ELEMENT, 4.7 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD SMT-Power-Inductors
File Size	73.53K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77313-824-68LF
Description	BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions
Tech specs				Official Product Page

					Hynix Semiconductor
Part No.	HY27UG084G2M HY27UG084G2D HY27UG084GDM
Description	(HY27UGxx Series) 2G-Bit NAND Flash
File Size	466.48K / 53 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77313-824-66LF
Description	BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 66 Positions
Tech specs				Official Product Page

					EPCOS
Part No.	B25836B8246A305
Description	Film capacitors - Power Factor Correction
File Size	451.53K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	48246-000LF
Description	PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs				Official Product Page

					EPCOS
Part No.	B78476A8246A003
Description	Magnetics modules for LAN applications
File Size	259.50K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68482-460HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					Glenair, Inc.
Part No.	230-018126P 230-018206P 230-018226P 230-018106P 230-018146P 230-018166P 230-018186P 230-018246P
Description	Hermetic Receptacle, Solder Flange Mount
File Size	288.47K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE451882461
Description	Modular Jack - High Performance, Input Output Connectors 8P8C, Vertical, CAT6, Shield, With LEDs.
Tech specs				Official Product Page

					Intersil Corporation
Part No.	ISL28246 ISL28246FBZ ISL28246FBZ-T7 ISL28246FUZ ISL28246FUZ-T7 ISL28146FHZ-T7 ISL28146FHZ-T7A ISL28146
Description	5MHz, Single and Dual Rail-to-Rail Input-Output (RRIO) Op Amps
File Size	770.85K / 15 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77313-824-64LF
Description	BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 64 Positions
Tech specs				Official Product Page

					Hynix Semiconductor, Inc.
Part No.	HY27UG088G5M HY27UG088GDM HY27UG088GDM-UPEB HY27UG088G5M-TEB HY27UG088G5M-TPMB HY27UG088GDM-UPMB HY27UG088G5M-TPIB HY27UG088G5M-TPCB HY27UG088GDM-UPCB HY27UG088G5M-TCB HY27UG088G5M-TPEB HY27UG088G5M-TIP HY27UG088G5M-TIB HY27UG088G5M-TIS HY27UG088GDM-UPIB
Description	8Gbit (1Gx8bit) NAND Flash 1G X 8 FLASH 3.3V PROM, 25 ns, PBGA52 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52 1G X 8 FLASH 3.3V PROM, 25 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48 1G X 8 FLASH 3.3V PROM, 25 ns, PDSO48 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48
File Size	349.43K / 50 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	68482-468HLF
Description	BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					EPCOS AG EPCOS[EPCOS]
Part No.	B82462-G4102-M B82462-G4 B82462-G4821-M B82462-G4103-M B82462-G4104-M B82462-G4105-M B82462-G4122-M B82462-G4152-M B82462-G4153-M B82462-G4154-M B82462-G4222-M B82462-G4223-M B82462-G4224-M B82462-G4332-M B82462-G4333-M B82462-G4334-M B82462-G4472-M B82462-G4473-M B82462-G4474-M B82462-G4682-M B82462-G4683-M B82462-G4684-M B82462G4
Description	1 ELEMENT, 1.2 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD SMT-Power-Inductors
File Size	467.35K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	67998-246HLF
Description	BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
Tech specs				Official Product Page

					Hynix Semiconductor, Inc. HYNIX SEMICONDUCTOR INC
Part No.	HY27UG164GDM-UPEB HY27UG084GDM-UPEB HY27UG164G2M-TPCP HY27UG164G2M-TPIP HY27UG164G2M-TPES
Description	256M X 16 FLASH 3.3V PROM, 30 ns, PBGA52 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52 512M X 8 FLASH 3.3V PROM, 30 ns, PBGA52 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, ULGA-52 256M X 16 FLASH 3.3V PROM, 30 ns, PDSO48
File Size	452.53K / 54 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	77313-824-62LF
Description	BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions
Tech specs				Official Product Page

For GDM-8246 Found Datasheets File :: 111+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 |

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