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  DIALIGHTCORP-891-1W02-111-RA-0 Datasheet PDF File

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    ROS-EDR6111/1

MINI-CIRCUITS
Part No. ROS-EDR6111/1
Description VCO, 365 MHz - 405 MHz

File Size 89.57K  /  1 Page

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HUA FENG CIRCUIT





    Dialight PLC
Part No. 550-3X05 DIALIGHTCORP-550-3505
Description 5mm LED CBI Circuit Board Indicator 3 Leaded, Bi-Color, Common Cathode 中缅印战毫米的LED电路板指引线,双色,共阴

File Size 24.22K  /  2 Page

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    Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. ACPM-7891-TR1 ACPM-7891 ACPM-7891-BLK
Description ACPM-7891 · Tri-band GPRS (Class10) GSM PA
Agilent ACPM-7891 Tri-Band Power Amplifier Module EGSM, DCS and PCS Multi-slot GPRS

File Size 203.29K  /  23 Page

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    87891-1818

Molex Electronics Ltd.
Part No. 87891-1818
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free

File Size 287.95K  /  5 Page

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    87891-4006

Molex Electronics Ltd.
Part No. 87891-4006
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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    87891-1817

Molex Electronics Ltd.
Part No. 87891-1817
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free

File Size 287.95K  /  5 Page

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    87891-0606

Molex Electronics Ltd.
Part No. 87891-0606
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 6 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.44K  /  10 Page

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    Raltron Electronics, Corp.
Part No. H180A-3.8912-20
Description SURFACE MOUNT MICROPROCESSOR CRYSTAL 表面贴装微处理器晶体

File Size 63.56K  /  1 Page

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    MELEXIS
Part No. US890 US891
Description Two-Coil Fan Driver

File Size 1,249.71K  /  12 Page

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    87891-0408

Molex Electronics Ltd.
Part No. 87891-0408
Description 2.54mm (.100) Pitch KK庐 Header, Through Hole, Vertical, 4 Circuit, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Vertical, 4 Circuit, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 287.76K  /  5 Page

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