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N.A.
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| Part No. |
M6MGB166S4BWG
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| OCR Text |
... 16-BIT) CMOS SRAM Stacked-CSP (Chip Scale Package)
DESCRIPTION The MITSUBISHI M6MGB/T166S4BWG is a Stacked Chip Scale Package (S-CSP) that contents 16M-bits flash memory and 4M-bits Static RAM in a 72-pin S-CSP. 16M-bits Flash memory is... |
| Description |
3.3V-ONLY FLASH MEMORY
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| File Size |
255.61K /
31 Page |
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it Online |
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Maxim Integrated Products, Inc.
MAXIM INTEGRATED PRODUCTS INC
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| Part No. |
DS2762BX-025/TAMPR DS2762AE025/TAMPR
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| OCR Text |
...either a tssop package or flip-chip package. the ds2762 is a key component in applications including remaining capacity estimation, safet...scale magnitude t fs 127 c temperature error t err (note 6) 3 c voltage resolu... |
| Description |
High-Precision Li Battery Monitor with Alerts 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA14
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| File Size |
264.99K /
25 Page |
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it Online |
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Freescale Semiconductor
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| Part No. |
MPXV5004XXX
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| OCR Text |
...ted silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpxv5004g series pi ezoresistive trans...scale span, as a percent of v fss , at 25 c . v off 0.75 1.0 1.25 mv sensitivity v/p ? 1.0 9.8 ? v/... |
| Description |
(MPXV5004G Series) Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
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| File Size |
469.63K /
12 Page |
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it Online |
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