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Texas Instruments |
| Part No. |
5962-8776001SRA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
5962-8776001MRA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601016 87760-1016
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.54K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
5962-8776001M2A
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601017 87760-1017
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.37K /
4 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
5962-8776001SSA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877600838 87760-0838
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 8 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-f
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| File Size |
155.18K /
4 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
5962-8776001MSA
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| Description |
Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87760-1816 0877601816
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.35K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
57102-S08-17LF
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| Description |
Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 34 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601618 87760-1618
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
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| File Size |
160.06K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
57102-F08-17LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601617 87760-1617
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.17K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
108-1711-100
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, With Post, No Key.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54201-G0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54102-T0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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