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  87759-4251 Datasheet PDF File

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    87759-3875

Molex Electronics Ltd.
Part No. 87759-3875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,
File Size 280.29K  /  6 Page

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Texas Instruments
Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs 　 　

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HUA FENG CIRCUIT





    87759-1615

Molex Electronics Ltd.
Part No. 87759-1615
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.46K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

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    87759-1815

Molex Electronics Ltd.
Part No. 87759-1815
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 279.39K  /  6 Page

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Texas Instruments
Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    87759-3214

Molex Electronics Ltd.
Part No. 87759-3214
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.10K  /  8 Page

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Amphenol Communications Solutions
Part No. 79425-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-4014

Molex Electronics Ltd.
Part No. 87759-4014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 563.47K  /  11 Page

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Amphenol Communications Solutions
Part No. 79425-140HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-4015

Molex Electronics Ltd.
Part No. 87759-4015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 383.21K  /  9 Page

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Amphenol Communications Solutions
Part No. 79425-160HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

    87759-3014

Molex Electronics Ltd.
Part No. 87759-3014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
File Size 420.16K  /  8 Page

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Amphenol Communications Solutions
Part No. 10128425-11JLF
Description ExaMAX® 56Gb/s High Speed Backplane Connector 92Ohm, 6-Pair, 10 column, 200 position, Right Angle Header, Right Guide Pin.
Tech specs 　 　

Official Product Page

    87759-4076

Molex Electronics Ltd.
Part No. 87759-4076
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.72K  /  6 Page

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Amphenol Communications Solutions
Part No. 59112-G34-25-111LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 50 Positions.
Tech specs 　 　

Official Product Page

    87759-4465

Molex Electronics Ltd.
Part No. 87759-4465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
File Size 280.27K  /  6 Page

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Amphenol Communications Solutions
Part No. 10034251-101LF
Description AirMax VS®, Backplane Connectors, Receptacle, Vertical, Press-Fit, 3 Pair, 10 Column, 90 Position, 2.00mm (0.079in) Pitch
Tech specs 　 　

Official Product Page

    87759-1476

Molex Electronics Ltd.
Part No. 87759-1476
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap
File Size 355.83K  /  6 Page

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Amphenol Communications Solutions
Part No. 79425-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs 　 　

Official Product Page

For 87759-4251 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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