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  74300-1153 Datasheet PDF File

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    74300-7143 0743007143

Molex Electronics Ltd.
Part No. 74300-7143 0743007143
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 72 Circuits, Mounted Height 13.00mm (.512), Press-Fit Pin Length
File Size 145.06K  /  3 Page

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Amphenol Communications Solutions
Part No. 47743-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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HUA FENG CIRCUIT





    74300-0127 0743000127

Molex Electronics Ltd.
Part No. 74300-0127 0743000127
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide
File Size 145.04K  /  3 Page

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Amphenol Communications Solutions
Part No. 10111743-008LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

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    0743001143 74300-1143

Molex Electronics Ltd.
Part No. 0743001143 74300-1143
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits
File Size 145.23K  /  3 Page

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Amphenol Communications Solutions
Part No. 47743-002LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs 　 　

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    0743001144 74300-1144

Molex Electronics Ltd.
Part No. 0743001144 74300-1144
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard Receptacle, Vertical, SignalModule, with Guide, 144 Circuits, Mounted Height 14.00mm (.551), Press-Fit Pin
File Size 145.23K  /  3 Page

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Amphenol Communications Solutions
Part No. U10A474300T
Description SlimSAS Right angle X8 15u\\ Gold plating, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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    0743003157 74300-3157

Molex Electronics Ltd.
Part No. 0743003157 74300-3157
Description 2.00mm (.079) Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide
File Size 136.18K  /  3 Page

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Amphenol Communications Solutions
Part No. U10BH7430001T
Description SlimSAS Vertical X8 15u\\ Gold plating, Latch pin inside, Latch pin length=1.5mm, 24G, T&R packing
Tech specs 　 　

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    87874-3001 0878743001

Molex Electronics Ltd.
Part No. 87874-3001 0878743001
Description 5.08mm (.200), 2.54mm (.100) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus Pa-S Header, Through Hole, Right Angle, Screw Mount
File Size 256.17K  /  5 Page

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Amphenol Communications Solutions
Part No. 10111743-009LF
Description HPCE R/A REC 52P22S
Tech specs 　 　

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    AS1158-T AS1155-T AS1153-T AS1155

austriamicrosystems AG
Part No. AS1158-T AS1155-T AS1153-T AS1155
Description Single/Dual LVDS Receivers
File Size 290.06K  /  15 Page

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Amphenol Communications Solutions
Part No. 77430-001LF
Description Din Accessory Shroud Stand off
Tech specs 　 　

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    SD-74300-004 743000123 0743000123

Molex Electronics Ltd.
Part No. SD-74300-004 743000123 0743000123
Description 2.00mm (.079) Pitch HDM? Board-to-Board Daughtercard
File Size 145.04K  /  3 Page

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Amphenol Communications Solutions
Part No. GSB3115373RF1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3.0mm, Blue High Temperature Housing, Tape and Reel Packaging
Tech specs 　 　

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    DAS1152 DAS1153

Intronics Power, Inc.
Part No. DAS1152 DAS1153
Description 14-Bit & 15-Bit Sampling Analog To Digital Converter
File Size 855.77K  /  4 Page

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Amphenol Communications Solutions
Part No. GSB3115383RF6HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell Without Flange(T/B), Shell with Nickel Plating, Shell Dip Pitch 17.42mm, 30u\\ Gold, Dip 3.0mm, Black High Temperature Housing, Tape and Reel Packaging
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    2SK1153 2SK1154

HITACHI[Hitachi Semiconductor]
Part No. 2SK1153 2SK1154
Description Silicon N Channel MOS FET
Silicon N-Channel MOS FET
File Size 47.74K  /  9 Page

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Amphenol Communications Solutions
Part No. GSB3115373FHR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Sink, 9.91mm Height, 18 Pins, Shell with Nickel Plating, Shell Dip Pitch 15.6mm, 30u\\ Gold, Dip 3mm, Blue High Temperature Housing, Tray Packaging
Tech specs 　 　

Official Product Page

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