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  6083 Datasheet PDF File

For 6083 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    K4H560838E-GC/LA2 K4H560838E-GC/LB0 K4H560838E-GC/LB3 K4H560438E-GC/LA2 K4H560438E-GC/LB0 K4H560438E-GC/LB3 K4H560438E-G

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
http://
Part No. K4H560838E-GC/LA2 K4H560838E-GC/LB0 K4H560838E-GC/LB3 K4H560438E-GC/LA2 K4H560438E-GC/LB0 K4H560438E-GC/LB3 K4H560438E-GLB0 K4H560438E-GLB3 K4H560438E-GCB3 K4H560438E-GCA2 K4H560838E-GCA2 K4H560438E-GCB0 K4H560838E-GCB0 K4H560838E-GLB0 K4H560838E-GLB3 K4H560838E-GLA2
Description DIODE ZENER TRIPLE ISOLATED 200mW 39.13Vz 5mA-Izt 0.02518 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 36.28Vz 5mA-Izt 0.02522 0.05uA-Ir 30 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 22.08Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 22.1Vz 5mA-Izt 0.02514 0.05uA-Ir 17 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 13.79Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 14Vz 10mA-Izt 0.02503 0.05uA-Ir 11 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 12.9Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 11.1Vz 10mA-Izt 0.02523 0.1uA-Ir 8.4 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER TRIPLE ISOLATED 200mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-363 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 12Vz 10mA-Izt 0.02532 0.1uA-Ir 9.1 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 19.7Vz 10mA-Izt 0.0251 0.05uA-Ir 15 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格60Ball FBGA封装（x4/x8
DIODE ZENER SINGLE 300mW 23.7Vz 5mA-Izt 0.02509 0.05uA-Ir 19 SOT-23 3K/REEL
DIODE ZENER TRIPLE ISOLATED 200mW 12.88Vz 10mA-Izt 0.02562 0.1uA-Ir 10 SOT-363 3K/REEL
256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
   256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size 245.98K  /  24 Page

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Amphenol Communications Solutions
Part No. G832MC030608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold White.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4H560438E-NC/LA2 K4H560838E-NC/LA2 K4H560438E-NC/LB0 K4H560838E-NC/LB0 K4H560438E-NC/LB3 K4H560838E-NC/LB3 K4H560438E-N

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438E-NC/LA2 K4H560838E-NC/LA2 K4H560438E-NC/LB0 K4H560838E-NC/LB0 K4H560438E-NC/LB3 K4H560838E-NC/LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560838E-NCA2 K4H560438E-NCB3 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLB0 K4H560438E-NLB3 K4H560438E-NLB0 K4H560838E-NLB3 K4H560838E-NLA2
Description 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II) 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二
DIODE ZENER SINGLE 300mW 43Vz 5mA-Izt 0.02 0.05uA-Ir 33 SOT-23 3K/REEL 256Mb的电子芯片DDR SDRAM内存规格54pin sTSOP（二
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 20-HTSSOP 0 to 70
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-SOIC -40 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-SOIC
   256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)
File Size 216.89K  /  24 Page

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Amphenol Communications Solutions
Part No. G832MC010608322HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 18.7 mm, 60 Positions, Dual Row, BTB Vertical Receptacle SMT, 8u\\ Gold Black.
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-VLB3 K4H560438E-VC K4H560438E-VC_LA2 K4H560438E-VC_LB0 K4H560438E-VC_LB3 K4H560438E-VCA2 K4H560438E-VCB0 K4H560438E-VCB3 K4H560438E-VLA2 K4H560438E-VLB0 K4H560438E-VLB3 K4H560838E-VC_LA2 K4H560838E-VC_LB0 K4H560838E-VC_LB3 K4H560838E-VCA2 K4H560838E-VCB0 K4H560838E-VCB3 K4H560838E-VLA2 K4H560838E-VLB0
Description 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant)
File Size 294.46K  /  23 Page

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Amphenol Communications Solutions
Part No. 75160-839-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-NLB3 K4H560438E-NC K4H560438E-NC_LA2 K4H560438E-NC_LB0 K4H560438E-NC_LB3 K4H560438E-NCA2 K4H560438E-NCB0 K4H560438E-NCB3 K4H560438E-NLA2 K4H560438E-NLB0 K4H560438E-NLB3 K4H560838E-NC_LA2 K4H560838E-NC_LB0 K4H560838E-NC_LB3 K4H560838E-NCA2 K4H560838E-NCB0 K4H560838E-NCB3 K4H560838E-NLA2 K4H560838E-NLB0
Description 256Mb E-die DDR SDRAM Specification 54pin sTSOP(II)
File Size 212.16K  /  24 Page

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Amphenol Communications Solutions
Part No. 10137926-0831LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-GLB3 K4H560438E-GC K4H560438E-GC_LA2 K4H560438E-GC_LB0 K4H560438E-GC_LB3 K4H560438E-GCA2 K4H560438E-GCB0 K4H560438E-GCB3 K4H560438E-GLA2 K4H560438E-GLB0 K4H560438E-GLB3 K4H560838E-GC_LA2 K4H560838E-GC_LB0 K4H560838E-GC_LB3 K4H560838E-GCA2 K4H560838E-GCB0 K4H560838E-GCB3 K4H560838E-GLA2 K4H560838E-GLB0
Description 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8)
File Size 241.25K  /  24 Page

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Amphenol Communications Solutions
Part No. 10137926-0832LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    K4H560438D-NC/LA0 K4H560838D-NC/LA0 K4H560438D-NC/LA2 K4H560838D-NC/LA2 K4H560438D-NC/LB0 K4H560838D-NC/LB0 K4H560438D-N

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438D-NC/LA0 K4H560838D-NC/LA0 K4H560438D-NC/LA2 K4H560838D-NC/LA2 K4H560438D-NC/LB0 K4H560838D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LB3
Description 256Mb sTSOPII 256Mb的sTSOPII
DIODE ZENER SINGLE 300mW 10Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-23 3K/REEL
DIODE ZENER SINGLE 200mW 9.1Vz 20mA-Izt 0.02592 0.1uA-Ir 7 SOD-323 3K/REEL
DIODE ZENER TRIPLE ISOLATED 200mW 9.95Vz 20mA-Izt 0.02513 0.1uA-Ir 8 SOT-363 3K/REEL
File Size 93.90K  /  18 Page

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Amphenol Communications Solutions
Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4H560838D-NC_LA0 K4H560838D-NC_LA2 K4H560838D-NC_LB0 K4H560838D-NC_LB3 K4H560438D-NC_LB3 K4H560438D-NC K4H560438D-NC_LA

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H560838D-NC_LA0 K4H560838D-NC_LA2 K4H560838D-NC_LB0 K4H560838D-NC_LB3 K4H560438D-NC_LB3 K4H560438D-NC K4H560438D-NC_LA0 K4H560438D-NC_LA2 K4H560438D-NC_LB0 K4H560438D-NC/LA0 K4H560438D-NC/LA2 K4H560438D-NC/LB0 K4H560438D-NC/LB3 K4H560838D-NC/LA0 K4H560838D-NC/LA2 K4H560838D-NC/LB0 K4H560838D-NC/LB3
Description 256MB STSOPII
File Size 89.94K  /  18 Page

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Amphenol Communications Solutions
Part No. 75160-835-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,16 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    K4H560838E K4H560838E-TC_LB3 K4H560438E-TC_LA2 K4H560438E-TC_LAA K4H560438E-TC_LB0 K4H560438E-TC_LB3 K4H560838E-TC_LA2 K

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H560838E K4H560838E-TC_LB3 K4H560438E-TC_LA2 K4H560438E-TC_LAA K4H560438E-TC_LB0 K4H560438E-TC_LB3 K4H560838E-TC_LA2 K4H560838E-TC_LAA K4H560838E-TC_LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB0 K4H560838E-TC/LB3
Description DDR SDRAM 256Mb E-die (x4, x8)
File Size 211.78K  /  24 Page

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Amphenol Communications Solutions
Part No. 75160-839-15LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,15 position, 2.54mm pitch
Tech specs 　 　

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-ULB3 K4H560438E-UC K4H560438E-UC_LA2 K4H560438E-UC_LAA K4H560438E-UC_LB0 K4H560438E-UC_LB3 K4H560438E-UCA2 K4H560438E-UCAA K4H560438E-UCB0 K4H560438E-UCB3 K4H560438E-ULA2 K4H560438E-ULAA K4H560438E-ULB0 K4H560438E-ULB3 K4H560838E-UC_LA2 K4H560838E-UC_LAA K4H560838E-UC_LB0 K4H560838E-UC_LB3 K4H560838E-UCA2 K4H560838E-UCAA K4H560838E-UCB0 K4H560838E-UCB3 K4H560838E-ULA2 K4H560838E-ULAA K4H560838E-ULB0
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
File Size 294.24K  /  23 Page

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Amphenol Communications Solutions
Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ULAA K4H560838E-ULAA K4H560438E-UCAA K4H560838E-UCAA K4H560438E-ULB0 K4H560438E-ULA2 K4H560438E-ULB3 K4H560438E-UC/LAA K4H560838E-ULB3 K4H560438E-UCB3 K4H560438E-UCB0 K4H560838E-UCB3 K4H560438E-UC/LA2 K4H560438E-UC/LB0 K4H560438E-UC/LB3 K4H560438E-UCA2 K4H560838E-UC/LB0 K4H560838E-UC/LA2 K4H560838E-UC/LB3 K4H560838E-UCB0 K4H560838E-UC/LAA K4H560838E-UCA2 K4H560838E-ULA2
Description 256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与DDR SDRAM的规格铅66 TSOP-II免费（符合RoHS
File Size 298.78K  /  23 Page

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Amphenol Communications Solutions
Part No. RJHSE6083
Description Modular Jack - 8P8C, Vertical, Single Port, With Panel Stops, No Shield, With LEDs
Tech specs 　 　

Official Product Page

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