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For substrate. Found Datasheets File :: 21964    Search Time::1.266ms    
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    NJM12904 NJM12904D NJM12904E NJM12904L NJM12904M NJM12904R NJM12904V PHA2731-190M

MA-Com
MACOM[Tyco Electronics]
Analog Devices, Inc.
Part No. NJM12904 NJM12904D NJM12904E NJM12904L NJM12904M NJM12904R NJM12904V PHA2731-190M
OCR Text ... class C power transistors Soft substrate r = 10.5 Hermetic Package Nickel plated copper flange Outline Drawing1 Description M/A-COM's PHA2731-190M is a Class C microwave power amplifier module specifically designed for S-Band radar ...
Description Radar Pulsed Power Amplifier.190 Watts 2.7.3.1 GHz / 200s Pulse / 10 Duty
Radar Pulsed Power Amplifier-190 Watts 2.7-3.1GHz,200ms Pulse,10% Duty
Radar Pulsed Power Amplifier.190 Watts 2.7.3.1 GHz, 200s Pulse, 10 Duty
Radar Pulsed Power Amplifier.190 Watts 2.7.3.1 GHz, 200レs Pulse, 10 Duty 雷达脉冲功率Amplifier.190.7.3.1千兆赫,200レ拧脉冲10职务

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    PALCE20V8H-10JC_4 PALCE20V8H-15JC_4 PALCE20V8H-15JI_4 PALCE20V8H-15PC_4 PALCE20V8H-15PI_4 PALCE20V8H-25JC_4 PALCE20V8H-2

LATTICE[Lattice Semiconductor]
Part No. PALCE20V8H-10JC_4 PALCE20V8H-15JC_4 PALCE20V8H-15JI_4 PALCE20V8H-15PC_4 PALCE20V8H-15PI_4 PALCE20V8H-25JC_4 PALCE20V8H-25JI_4 PALCE20V8H-25PC_4 PALCE20V8H-25PI_4 PALCE20V8H-5JC_5 PALCE20V8H-7JC_5 PALCE20V8Q-15JC_4 PALCE20V8Q-15PC_4 PALCE20V8Q-20JI_4 PALCE20V8Q-20PI_4 PALCE20V8Q-25JC_4 PALCE20V8Q-25PC_4 PALCE20V8Q-25PI_4 PALCE20V8 PALCE20V8H-7PC_5 PALCEB20V8H-10JC_4 PALCE20V8H-10PC_4 PALCE20V8Q-25JI_4
OCR Text ...ew-rate control, and a grounded substrate for clean switching. PCI Compliance PALCE20V8H devices in the -5/-7/-10 speed grades are fully compliant with the PCI Local Bus Specification published by the PCI Special Interest Group. The PALCE20...
Description EE CMOS 24-Pin Universal Programmable Array Logic

File Size 353.63K  /  27 Page

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    SD210DE SST823 SST824 SD5001N SD5401CY SST215

LINEAR[Linear Integrated Systems]
Part No. SD210DE SST823 SST824 SD5001N SD5401CY SST215
OCR Text ...op surface and one (the body or substrate) on the bottom. A Zener diode with a breakdown voltage of approximately 40 V is added to protect the gate against overvoltage and electrostatic discharges. Source Oxide Gate Drain (a) Off State ...
Description Voltage Regulator IC; Package/Case:5-SOT-23; Output Current:150mA; Output Voltage:2.9V; Supply Voltage Max:6V; Current Rating:150mA; Leaded Process Compatible:No; Output Current Max:150mA; Output Voltage Max:2.9V RoHS Compliant: No
Voltage Regulator IC; Output Current:150mA; Output Voltage:2.8V; Package/Case:5-SOT-23; Supply Voltage Max:6V; Current Rating:150mA; Leaded Process
HIGH SPEED DMOS FET ANALOG SWITCHES AND SWITCH ARRAYS

File Size 353.61K  /  11 Page

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    SD213 SD213DE SD211 SD211E SD215DE SD215 XSS211 XSD213 XSD215

Calogic LLC
Calogic LLC
CALOGIC[Calogic, LLC]
Part No. SD213 SD213DE SD211 SD211E SD215DE SD215 XSS211 XSD213 XSD215
OCR Text ...n protection diode from gate to substrate The SD211 is used with SD213 and SD215 DMOS analog switches. ORDERING INFORMATION Part SD211E XSS211 SD213DE XSD213 SD215DE XSD215 Package Hermetic TO-72 Package Sorted Chips in Carriers Hermetic TO...
Description DELAY LINE 2.0NS -50PS 16SOIC N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-72
(SD211/3/5) High-Speed Analo N-Channel DMOS FETs

File Size 29.14K  /  2 Page

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    74ALVC02 74ALVC02BQ 74ALVC02D 74ALVC02PW

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. 74ALVC02 74ALVC02BQ 74ALVC02D 74ALVC02PW
OCR Text ... 9 MNA951 (1) (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input. Fig.2 Pin configuration DHVQFN14. Fig.3 Logic diagram (one gate). handbook, halfpa...
Description Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:18-35 RoHS Compliant: No
Quad 2-input NOR gate

File Size 77.28K  /  13 Page

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    74LVT125BQ 74LVT125PW 74LVT125PWDH 74LVT125 74LVT125D 74LVT125DB

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74LVT125BQ 74LVT125PW 74LVT125PWDH 74LVT125 74LVT125D 74LVT125DB
OCR Text ...sparent top view (1) The die substrate is attached to the exposed die pad using conductive die attach material. It can not be used as a supply pin or input. Fig 4. Pin configuration SO14, SSOP14 and TSSOP14 Fig 5. Pin configuration...
Description 3.3 V quad buffer; 3-state
3.3V Quad buffer 3-State

File Size 81.91K  /  15 Page

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    AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586

Analog Devices, Inc.
AD[Analog Devices]
Part No. AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586KR AD586L AD586LQ AD586LR AD586M AD586MN AD586S AD586SQ AD586T AD586TQ AD586LN
OCR Text ...iform shape and size simplifies substrate design and die attach. Top Surface: The standard top surface of the die is covered by a layer of glassivation. All areas are covered except bonding pads and scribe lines. Surface Metalization: The m...
Description High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDIP8
High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, CDIP8
High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDSO8
High Precision 5 V Reference 高精 V参

File Size 196.90K  /  8 Page

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    AD587 AD587JCHIPS AD587JN AD587JQ AD587JR AD587KN AD587KQ AD587KR AD587LN AD587LQ AD587SQ AD587TQ AD587UQ

ANALOG DEVICES INC
Analog Devices, Inc.
Part No. AD587 AD587JCHIPS AD587JN AD587JQ AD587JR AD587KN AD587KQ AD587KR AD587LN AD587LQ AD587SQ AD587TQ AD587UQ
OCR Text ...iform shape and size simplifies substrate design and die attach. Top Surface: The standard top surface of the die is covered by a layer of glassivation . All areas are covered except bonding pads and scribe lines. Surface Metalization: The ...
Description High Precision 10 V Reference

File Size 115.88K  /  8 Page

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    AD74322 AD74322AAR AD74322AARU AD74322DAR AD74322DARU

AD[Analog Devices]
Part No. AD74322 AD74322AAR AD74322AARU AD74322DAR AD74322DARU
OCR Text ...Supply Connection Analog Ground/Substrate Connection Digital Power Supply Connection (Interface) Digital Power Supply Connection (Core) Digital Ground/Substrate Connection External Clock Connection Serial Data In on SPI Control Port Serial ...
Description Low Cost, Low Power Stereo Audio Analog Front End

File Size 114.14K  /  20 Page

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