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    Kingbright Corporation.
KINGBRIGHT[Kingbright Corporation]
Kingbright Electronic
Part No. KP-2012P3C
OCR Text ... Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units...
Description Made with silicon phototransistor chips

File Size 65.51K  /  3 Page

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    YAGEO Corporation
Part No. RL1206
OCR Text ...inations made by th ick film process. applications ? converters ? printer equipment ? server board ? telecom ? consumer features ? halogen free epo xy ? rohs compliant ? h azardous wastes ? ...
Description LOW OHMIC CHIP RESISTORS

File Size 447.78K  /  9 Page

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    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
OCR Text ...age - maximum 125v solder process data duration at max. process temperature (seconds) 10 lead-free process capability reflow capable (smt only) max. cycles at max. process temperature 3 process temper...
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 421.28K  /  8 Page

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    KINGBRIGHT[Kingbright Corporation]
Part No. KP-1608SECK
OCR Text ... Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units...
Description 1.6x0.8mm SMD CHIP LED LAMP

File Size 87.52K  /  4 Page

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    KINGBRIGHT[Kingbright Corporation]
Part No. KP-1608P1C
OCR Text ...nstructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units...
Description OHTOTRANSISTOR

File Size 62.18K  /  3 Page

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    Bosch
Part No. SMD288
OCR Text ...anced porous silicon membrane) process. th e apsm technology allows to produce a stable single-crystalline membrane with a cmos compatible surface micro-mechanic process. the evaluation circuit which is integrated on the same chip a...
Description Barometric pressure sensor

File Size 228.14K  /  2 Page

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    http://
MACOM[Tyco Electronics]
Part No. MAAMGM0002-SMB MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB
OCR Text ...e Select-at-Test Biasing MSAGTM process Description The MAAMGM0002-Die is a 0.1W Distributed Amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. The MMIC can be used as a broadban...
Description Amplifier, Distributed, 0.1W 1.0-18.0 GHz

File Size 181.88K  /  6 Page

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    MACOM[Tyco Electronics]
Part No. MAAMGM0003-DIE
OCR Text ...ion Self-Aligned MSAG(R) MESFET process Primary Applications EW Radar Description The MAAMGM0003-Die is a 0.4W Distributed Amplifier with on-chip bias networks and variable gain control. This product is fully matched to 50 ohms on...
Description 0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz

File Size 265.55K  /  7 Page

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    MACOM[Tyco Electronics]
Part No. MAAMGM0007-DIE
OCR Text ...ge (4-6V) Operation GaAs MSAGTM process Proven Manufacturability and Reliability No Airbridges Polyimide Scratch Protection No Hydrogen Poisoning Susceptibility Description The MAAMGM0007-Die is a single stage distributed amplifier wit...
Description 2.0-18.0 GHz Distributed Amp/Gain Block

File Size 315.57K  /  6 Page

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    SPANSION LLC
Part No. S98WS064RBOHI0023
OCR Text ...nt phases in t he manufacturing process that occur before full production is achieved. changes to the technical specifications presented in a preliminary document should be expected while keeping these as pects of production under consid...
Description SPECIALTY MEMORY CIRCUIT, PBGA88

File Size 310.28K  /  10 Page

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