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Amphenol Communications Solutions |
Part No. |
UE863T662020261
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Description |
2X6SFP ULTRAPORT WITH L/P
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10025026-10203TLF
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Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10025026-10103TLF
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Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10025026-10200TLF
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Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
26-19-2121 0026192121 AE-3190-NA 3190-12A
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Description |
3.96mm (.156") Pitch KK庐 Wire-to-Board Header, Vertical, Round Pin, with Polarizing Wall, 12 Circuits, Tin (Sn) Plating 3.96mm (.156) Pitch KK? Wire-to-Board Header, Vertical, Round Pin, with Polarizing Wall, 12 Circuits, Tin (Sn) Plating
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File Size |
227.34K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
51940-261LF
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Description |
PwrBlade®, Power Supply Connectors, 128S Vertical Receptacle.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10025026-10002PLF
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Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch .
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-410261920LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
70567-0011 A-70567-0011 0015800261
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
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File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-810261100LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
UE863G242060261
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Description |
2X2SFP ULTRAPORT COMBO
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-810261950LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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