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Motorola
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Part No. |
MPX5500
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OCR Text |
...erential
FLUORO SILICONE DIE coat DIE WIRE BOND
+5 V
STAINLESS STEEL METAL COVER P1 Vout Vs IPS 1.0 mF 0.01 mF GND 470 pF OUTPUT
LEAD FRAME
Motorola Sensor Device Data
EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEE... |
Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
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File Size |
90.87K /
6 Page |
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it Online |
Download Datasheet
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Motorola
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Part No. |
MPX4080D
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OCR Text |
...tial
FLUORO SILICONE GEL DIE coat WIRE BOND
DIE
STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE
LEAD FRAME
Figure 3 illustrates the differential sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates ... |
Description |
MPX4080D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
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File Size |
74.67K /
8 Page |
View
it Online |
Download Datasheet
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Motorola
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Part No. |
MPX5010 MPXV5010G
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OCR Text |
...ange.
FLUOROSILICONE GEL DIE coat P1 WIRE BOND
DIE
STAINLESS STEEL CAP
+5 V
Vout OUTPUT
THERMOPLASTIC CASE 1.0 mF 0.01 mF
Vs IPS GND 470 pF
LEAD FRAME
P2 DIFFERENTIAL SENSING ELEMENT DIE BOND
Figure 2. Cross-Sect... |
Description |
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned,Temperature Compensated and Calibrated
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File Size |
213.11K /
16 Page |
View
it Online |
Download Datasheet
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Motorola
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Part No. |
MPXV10GC MPX10
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OCR Text |
...tion Comparison
SILICONE DIE coat WIRE BOND
DIE
LEAD FRAME
Figure 4. Unibody Package -- Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A ... |
Description |
MPX10 10 kPa Uncompensated Silicon Pressure Sensors 10 kPa Uncompensated Silicon Pressure Sensors
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File Size |
151.56K /
8 Page |
View
it Online |
Download Datasheet
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Price and Availability
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