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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TTC5712
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| Description |
NPN Bipolar Transistor / VCEO=50 V / IC=3 A / hFE=400~1000 / VCE(sat)=0.14 V / tf=120 ns / PW-Mini
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
CY7C457-12NC-G
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| Description |
CY7C457 - FIFO, 2KX18, Synchronous
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68657-124HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail.
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-2261 0905712261
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 26 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50?Header, Vertical, Dual Row, Shrouded, DIN Keying, 26 Circuits, 0.1 μm Gold (Au)
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| File Size |
358.77K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68657-126HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail.
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| Tech specs |
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-2602 0905712602
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.76 μm Gold (Au)
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| File Size |
350.67K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
79257-126HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-2601 0905712601
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.1 μm Gold (Au)
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| File Size |
358.68K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69157-126HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-2641 0905712641
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 64 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 64 Circuits, 0.1 μm Gold (Au)
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| File Size |
358.67K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
380-5571-200
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| Description |
Receptacle,INFINX,6 Pair 10 Position 24MM,100MΩ, no lossy
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95157-120LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69157-124H
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
79257-128HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 28 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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