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  X28C513J-20T1 Datasheet PDF File

For X28C513J-20T1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    UPD166020T1F-E1-AY

Renesas Electronics Corporation
Part No. UPD166020T1F-E1-AY
Description MOS INTEGRATED CIRCUIT

File Size 374.70K  /  25 Page

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Amphenol Communications Solutions

Part No. 20021612-00020T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 20 contacts
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    X28C512 X28C512D X28C512D-12 X28C512D-15 X28C512DI-12 X28C512DI-15 X28C512DM X28C512DMB-12 X28C512DMB-15 X28C513JM-15 X2

INTERSIL[Intersil Corporation]
Part No. X28C512 X28C512D X28C512D-12 X28C512D-15 X28C512DI-12 X28C512DI-15 X28C512DM X28C512DMB-12 X28C512DMB-15 X28C513JM-15 X28C512E-12 X28C512E-15 X28C512E-20 X28C512E-25 X28C512EI-12 X28C512EI-20 X28C512EI-25 X28C512EM-12 X28C512EM-15 X28C512EM-20 X28C512EM-25 X28C512EMB-15 X28C512FM-12 X28C512FM-15 X28C512FM-20 X28C512FMB-12 X28C512FMB-15 X28C512FMB-20 X28C512FMB-25 X28C512J X28C512J-12T1 X28C512J-15T1 X28C512JI-12 X28C512JI-15T1 X28C512JIZ-12 X28C512JM-12 X28C512JM-15 X28C512JM-20 X28C512JM-25 X28C512JZ-12 X28C512KI-20 X28C512KM-12 X28C512KM-20 X28C512KM-25 X28C512KMB-25 X28C512P X28C512P-12 X28C512P-15 X28C512PI X28C512PI-12 X28C512PI-15 X28C512RMB-12 X28C513EI-20 X28C513EM X28C513EM-12 X28C513EM-15 X28C513EM-20 X28C513EM-25 X28C513EMB-15 X28C513EMB-20 X28C513EMB-25 X28C513J-12T1 X28C513J-15T1 X28C513J-20T1 X28C513JI-12T1 X28C513JI-15 X28C513JM-12
Description 5V, Byte Alterable EEPROM

File Size 591.76K  /  25 Page

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Amphenol Communications Solutions

Part No. 20021212-00020T1LF
Description Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 1.27 mm (.050in) Pitch.
Tech specs    

Official Product Page

    Intersil, Corp.
Part No. X28C513JI-12T2C7345 X28C513EM-12C7309 X28C512J-15T2 X28C513J-15C1030
Description 5V, Byte Alterable EEPROM; Temperature Range: -40&deg;C to 85&deg;C; Package: 32-PLCC 64K X 8 EEPROM 5V, 120 ns, PQCC32
5V, Byte Alterable EEPROM; Temperature Range: -40&deg;C to 85&deg;C; Package: 32-PLCC T&amp;R 64K X 8 EEPROM 5V, 120 ns, PQCC32
5V, Byte Alterable EEPROM; Temperature Range: -55&deg;C to 125&deg;C; Package: 32-CLCC 64K X 8 EEPROM 5V, 120 ns, CQCC32
5V, Byte Alterable EEPROM; Temperature Range: 0&degC to 70&deg;C; Package: 32-PLCC T&amp;R 64K X 8 EEPROM 5V, 150 ns, PQCC32
5V, Byte Alterable EEPROM; Temperature Range: 0&degC to 70&deg;C; Package: 32-PLCC 64K X 8 EEPROM 5V, 150 ns, PQCC32

File Size 596.12K  /  24 Page

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Amphenol Communications Solutions

Part No. 20021311-00020T1LF
Description 1.27mm (0.05in.) pitch, Receptacle Top entry, 20 contacts
Tech specs    

Official Product Page

    Q67050-A4268-A101 SIGC20T120L

Infineon Technologies AG
Part No. Q67050-A4268-A101 SIGC20T120L
Description IGBT3 Chip

File Size 67.59K  /  4 Page

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Amphenol Communications Solutions

Part No. G846A18120T1HR
Description Board mount - Header Receptacle - Wire to Board 1.0mm Pitch Right Angle SMT,2x9Pin,15u\\ Gold,NY9T,Latch Type,Color-Black
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KMM377S3320T1
Description 32Mx72 SDRAM DIMM(32M x 72 动RAM模块) 32Mx72 SDRAM的内存(32M × 72配置动态内存模块)

File Size 215.07K  /  14 Page

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Amphenol Communications Solutions

Part No. 20021621-00020T1LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 20 contacts
Tech specs    

Official Product Page

    PHP33NQ20T PHP33NQ20T127

NXP Semiconductors N.V.
Part No. PHP33NQ20T PHP33NQ20T127
Description N-channel TrenchMOS standard level FET, SOT78 (TO-220AB), Tube pack 32.7 A, 200 V, 0.077 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB

File Size 178.96K  /  13 Page

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Amphenol Communications Solutions

Part No. 20021521-00020T1LF
Description Minitek127®, Shrouded Board to Board Header, Surface Mount, 20 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    MAMK2520T1R0M

Taiyo Yuden (U.S.A.), Inc
Part No. MAMK2520T1R0M
Description Metal Core Wire-wound Chip Power Inductors

File Size 41.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 20021323-00020T1LF
Description Minitek127®, Board to Board Receptacle, Double Row, Bottom entry, 20 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    CDRH50D20T150

Sumida Corporation
Part No. CDRH50D20T150
Description Ferrite drum core construction, Magnetically shielded

File Size 242.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021834-10020T1LF
Description Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 20 positions, 1.27mm (0.500in) pitch.
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. MAKK2520T1R0M
Description Metal Core Wire-wound Chip Power Inductors

File Size 137.30K  /  1 Page

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Amphenol Communications Solutions

Part No. G846A40120T1HR
Description Board mount - Header Plug - Wire to Board 1.0mm Pitch Right Angle,SMT,2x20Pin,15u\\ Gold,NY9T,Latch Type
Tech specs    

Official Product Page

    Taiyo Yuden (U.S.A.), I...
Part No. MBMK2520T1R5M
Description Metal Wire-wound Chip Power Inductors

File Size 136.00K  /  1 Page

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Amphenol Communications Solutions

Part No. G846A20120T1HR
Description Board mount - Header Plug - Wire to Board 1.0mm Pitch Right Angle SMT,2x10Pin,15u\\ Gold,NY9T,Latch Type,Color-Black
Tech specs    

Official Product Page

For X28C513J-20T1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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