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WD205LU ACP20015 DT70V HDF0515D 18CV8ZP 1N2246A 3N252 M25PX16
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For thickness Found Datasheets File :: 42099    Search Time::1.203ms    
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    Rotary
Part No. SPO18
OCR Text ...nchor loads, a minimim concrete thickness of 4-1/4 and anchor embedment of 3-1/4 is required at each anchor location. when using the standard supplied 3/4 x 5-1/2 lg. anchors, if the top of the anchor exceeds 2-1/4 above the ?oor grade...
Description (SPO15 / SPO18) Installation Instructions

File Size 2,178.31K  /  12 Page

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    HS0-26CT31RH-Q 5962F9563201V9A 5962F9563201VEC 5962F9563201VXC HS9-26CT31RH-Q HS9-26CT31RH-8 HS1-26CT31RH HS1-26CT31RH-8

Intersil, Corp.
Intersil Corporation
Part No. HS0-26CT31RH-Q 5962F9563201V9A 5962F9563201VEC 5962F9563201VXC HS9-26CT31RH-Q HS9-26CT31RH-8 HS1-26CT31RH HS1-26CT31RH-8 HS1-26CT31RH-Q 5962F9563201QXC
OCR Text ... PSG (Phosphorus Silicon Glass) thickness: 10kA 1kA Metallization: M1: Mo/TiW thickness: 5800A M2: Al/Si/Cu (Top) thickness: 10kA 1kA Substrate: AVLSI1RA Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up...
Description Radiation Hardened Quad Differential Line Driver 辐射加固四路差分线路驱动
Radiation Hardened Quad Differential Line Driver QUAD LINE DRIVER, UUC16

File Size 60.03K  /  2 Page

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    HS0-5104ARH-Q

Intersil, Corp.
Intersil Corporation
Part No. HS0-5104ARH-Q
OCR Text ...er Silox (SIO2, 5% Phos.) Silox thickness: 12kA 2kA Nitride thickness: 3.5kA 1.5kA Top Metallization: Type: Al, 1% Cu thickness: 16kA 2kA Substrate: Bipolar Dielectric Isolation Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substra...
Description Radiation Hardened Low Noise Quad Operational Amplifier QUAD OP-AMP, 3000 uV OFFSET-MAX, 8 MHz BAND WIDTH, UUC14

File Size 37.37K  /  3 Page

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    LB120A3

Cystech Electonics Corp.
Cystech Electonics Corp...
Part No. LB120A3
OCR Text ... millimeter s. 2.maximum lead thickness include s lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is an y q uestion w i th p a ck ing specification or p a cking metho d , pleas...
Description General Purpose NPN Epitaxial Planar Transistor

File Size 105.20K  /  3 Page

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    COOPER INDUSTRIES
Part No. HCF1007-4R7-R
OCR Text ... ac currents. pcb layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case operatin...
Description 1 ELEMENT, 4.7 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 495.79K  /  4 Page

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    GA1A2S100SS GA1A2S100LY

Sharp Electrionic Components
Sharp Electrionic Compo...
Part No. GA1A2S100SS GA1A2S100LY
OCR Text ... transparent 5. the thin bu rr thickness (0.05 mm max.) and the gate bu rr (0.3 mm max.) are not incl u ded in o u tline dimensions 6. resin protr u sion: 1.4 mm max. ho w e v er, the thin bu rr adheres to the lead 1.4 mm max. from the r...
Description OPIC Linear Output Ambient Light Sensor
OPIC?Linear Output Ambient Light Sensor

File Size 415.14K  /  10 Page

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    HS0-6254RH-Q HS1-6254RH HS-6254RH 5962F9764101VXC 5962F9764101VEC HS1-6254RH/SAMPLE HS1B-6254RH-Q 5962F9764101VEA HS1-62

Intersil Corporation
Intersil, Corp.
Part No. HS0-6254RH-Q HS1-6254RH HS-6254RH 5962F9764101VXC 5962F9764101VEC HS1-6254RH/SAMPLE HS1B-6254RH-Q 5962F9764101VEA HS1-6254RH-Q HS9-6254RH-Q
OCR Text ...LS: Glassivation: Type: Nitride thickness: 4kA 0.5kA Top Metallization: Type: Metal 1: AlCu (2%)/TiW thickness: Metal 1: 8kA 0.5kA Type: Metal 2: AlCu (2%) thickness: Metal 2: 16kA 0.8kA Substrate: UHF-1X Bonded Wafer, DI Backside Finish: S...
Description Radiation Hardened Ultra High Frequency NPN Transistor Array(抗辐射甚高频NPN晶体管阵
1500PF 50V 0805
BJT
Radiation Hardened Ultra High Frequency NPN Transistor Array 辐射加固超高频NPN晶体管阵

File Size 30.64K  /  3 Page

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    HS0-9008RH-Q 5962F9669601VYC 5962F9669601QXC 5962F9669601VXC HS1-9008RH HS9-9008RH HS-9008RH HS9-9008RH-8 HS1-9008RH-8 H

Intersil Corporation
Intersil, Corp.
Part No. HS0-9008RH-Q 5962F9669601VYC 5962F9669601QXC 5962F9669601VXC HS1-9008RH HS9-9008RH HS-9008RH HS9-9008RH-8 HS1-9008RH-8 HARRISSEMICONDUCTOR-HS9-9008RH-8 5962F9669601QYC HS1-9008RH-Q HS9-9008RH-Q
OCR Text ...RIALS: Glassivation: Type: SiO2 thickness: 8kA 1kA Top Metallization: Metal 1 - Type: Moly/TiW thickness: 5.8kA 10% Metal 2- Type: Al/Si/Cu thickness: 10kA 10% Backside Finish: Silicon ASSEMBLY RELATED INFORMATION: Substrate Potential (Powe...
Description CMOS 8-Bit Flash Analog-to-Digital Converter(CMOS8位带Flash存储器的A/D转换
Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDFP28
Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28
Radiation Hardened CMOS 8-Bit Flash Analog-to-Digital Converter 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, UUC28

File Size 192.99K  /  5 Page

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    B37550JXXXX B37550KXXXX

EPCOS
Part No. B37550JXXXX B37550KXXXX
OCR Text ...ter tape (blister tape for chip thickness 1,2 0,1 mm and case size 1210) 180-mm and 330-mm reel available electrical data temperature characteristic x8r climatic category (iec 60068-1) 55/150/56 standard eia dielectric cla...
Description Multilayer Ceramic Capacitors

File Size 170.55K  /  10 Page

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