single event total dose harden pdf Datasheet P6 Description --- IC-ON-LINE


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single event total dose harden Datasheet PDF File

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				Brady, Corp. Intersil Corporation
Part No.	5962F0254201QXC 5962F0254201VXC ISL7124SRH ISL7124SRHF ISL7124SRHQF ISL7124SRHVF ISL7124SRHF/PROTO
Description	Operational Amplifier 运算放大 single-event hardened, single Supply, Quad Operational Amplifier Operational Amplifier, single-event Rad-Hard, single Supply, Quad, 0.3V/s Slew Rate single-event hardened/ single Supply/ Quad Operational Amplifier 1.0 Amp Power Operational Amplifier
File Size	123.08K / 2 Page	View it Online	Download Datasheet

				Aeroflex Circuit Technology
Part No.	5962H0153601QYC 5962H0153601QYX 5962H0153601VYA 5962H0153601VYC UT54LVDM328UCC UT54LVDM328UCX 5962F0153601QYA 5962F0153601QYX 5962F0153601QYC 5962F0153601VYA 5962F0153601VYC 5962F0153601VYX 5962G0153601QYC 5962G0153601QYA 5962G0153601QYX 5962G0153601VYA 5962G0153601VYC 5962G0153601VYX 5962R0153601QYA
Description	Octal 400 Mbps bus LVDS repeater:SMD. total dose 1E6 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. total dose 1E6 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 1E6 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. total dose 1E6 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater. Lead finish gold. Octal 400 Mbps bus LVDS repeater. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class Q. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. total dose 3E5 rad(Si). QML class V. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class Q. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class Q. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class Q. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class V. Lead finish hot solder dipped. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class V. Lead finish gold. Octal 400 Mbps bus LVDS repeater:SMD. total dose 5E5 rad(Si). QML class V. Lead finish factory option. Octal 400 Mbps bus LVDS repeater:SMD. total dose 1E5 rad(Si). QML class Q. Lead finish hot solder dipped.
File Size	76.98K / 14 Page	View it Online	Download Datasheet

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Part No.	5962D9960601QUA 5962D9960601QUC 5962D9960601QUX 5962D9960601TUA 5962D9960601TUC 5962D9960601TUX 5962D9960602QUA 5962D9960602QUC 5962D9960602QUX 5962D9960602TUA 5962D9960602TUX 5962D9960602TUC 5962-9960601TUA 5962-9960602TUX 5962-9960601TUC 5962P9960601TUA 5962P9960601TUC 5962P9960601TUX UT7Q512K-UPX UT7Q512K-UWC
Description	512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish gold. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish factory option. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish gold. total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. total dose 3E4(30krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. total dose 3E4(30krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. total dose 3E4(30krad(Si)). 512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish factory option. 512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold.
File Size	106.53K / 16 Page	View it Online	Download Datasheet

				AEROFLEX[Aeroflex Circuit Technology]
Part No.	UT7C139C45GCX UT7C138C45GCA UT7C138C45WCC UT7C138C55WCA UT7C138C55WPA UT7C138 UT7C139C45GCA UT7C139C45GCC UT7C139C55WPX UT7C138C45GCC UT7C138C45GCX UT7C138C45GPA UT7C138C45GPC UT7C138C45GPX UT7C138C45WCA UT7C138C45WCX UT7C138C45WPA UT7C138C45WPC UT7C138C45WPX UT7C138C55GCA UT7C138C55GCC UT7C138C55GCX UT7C138C55GPA UT7C138C55GPC UT7C138C55GPX UT7C138C55WCC UT7C138C55WCX UT7C138C55WPC UT7C138C55WPX UT7C139 UT7C139C45GPA UT7C139C45GPC UT7C139C45GPX UT7C139C45WCA UT7C139C45WCC UT7C139C45WCX UT7C139C45WPA UT7C139C45WPC UT7C139C45WPX UT7C139C55GCA UT7C139C55GCC UT7C139C55GCX UT7C139C55GPA UT7C139C55GPC UT7C139C55GPX UT7C139C55WCA UT7C139C55WCC UT7C139C55WCX UT7C139C55WPA UT7C139C55WPC 5962G9684501QXA 5962G9684501QXC 5962G9684501QXX 5962G9684501QYA 5962G9684501QYC 5962G9684501QYX 5962G9684501VXA 5962G9684501VXC 5962G9684501VXX 5962G9684501VYA 5962G9684501VYC 5962G9684501VYX 5962G9684502QXA 5962G9684502QXC 5962G9684502QXX 5962G9684502QYA 5962G9684502QYC 5962G9684502QYX 5962G9684502VXA 5962G9684502VXC 5962G9684502VXX 5962G9684502VYA 5962G9684502VYC 5962G9684502VYX 5962G9684503QXA 5962G9684503QXC 5962G9684503QXX 5962G9684503QYA 5962G9684503QYX 5962G9684503QYC 5962F9684501QXA 5962F9684501QXX
Description	Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose 3E5 rads(Si). 4Kx9 dual-port SRAM. Lead finish gold. 55ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Prototype flow. 4Kx9 dual-port SRAM. Lead finish gold. 45ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Prototype flow. 4Kx8 dual-port SRAM. Lead finish optional. 55ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. 4Kx8 dual-port SRAM. Lead finish solder. 55ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose 3E5 rads(Si). 4Kx8/9 Radiation-hardened Dual-Port Static RAM with Busy Flag Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator V. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator V. Device type 02 (4Kx9, CMOS compatible inputs, 45 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish solder. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). total dose G. Federal stock class designator: no options. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class designator Q. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). total dose G. Federal stock class designator: no options. 4Kx8 dual-port SRAM. Lead finish solder. 45ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. 4Kx8 dual-port SRAM. Lead finish gold. 45ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Prototype flow. 4Kx8 dual-port SRAM. Lead finish gold. 55ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Prototype flow. 4Kx9 dual-port SRAM. Lead finish solder. 45ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. 4Kx9 dual-port SRAM. Lead finish optional. 45ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Dual-port SRAM: SMD with busy flag. Lead finish optional. Class Q. Device type 01 (4Kx8, CMOS compatible inputs, 45 ns). total dose 3E5 rads(Si). 4Kx9 dual-port SRAM. Lead finish optional. 55ns access time. CMOS-compatible inputs, 5.5V operation. total dose none. Dual-port SRAM: SMD with busy flag. Lead finish gold. Class V. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class V. Device type 03 (4Kx8, CMOS compatible inputs, 55 ns). total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish solder. Class V. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). total dose 3E5 rads(Si). Dual-port SRAM: SMD with busy flag. Lead finish gold. Class Q. Device type 04 (4Kx9, CMOS compatible inputs, 55 ns). total dose 3E5 rads(Si).
File Size	355.81K / 21 Page	View it Online	Download Datasheet

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Part No.	5962F0151701QXA 5962F0151701QXC 5962F0151701QXX 5962F0151701QYA 5962F0151701QYC 5962F0151701QYX 5962F0151701VXA 5962F0151701VXC 5962F0151701VXX 5962F0151701VYA 5962F0151701VYC 5962F0151701VYX 5962G0151701QXA 5962G0151701QXX 5962G0151701QXC 5962G0151701QYA 5962G0151701QYC 5962G0151701QYX 5962G0151701VXA 5962G0151701VYA 5962G0151701VYC 5962G0151701VYX 5962H0151701QXA 5962H0151701QXC 5962H0151701QYA 5962H0151701QYC 5962H0151701QYX UT28F256LVC-65UPX UT28F256LVC-65PPX
Description	Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish solder. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish gold. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish optional. total dose 3E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish solder. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish gold. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class V. 65ns acces time. Lead finish optional. total dose 5E5 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish solder. total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish gold. total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM: SMD. Class Q. 65ns acces time. Lead finish optional. total dose 1E6 rads(Si). Radiation-hardenet 32K x 8 PROM. 65ns acces time. Lead finish optional.
File Size	67.34K / 11 Page	View it Online	Download Datasheet

				Aeroflex Circuit Technology
Part No.	5962-9654001QEA
Description	RadHard MSI: SMD. Dual J-K flip-flop. Class Q, QML. Lead finish solder. total dose none.
File Size	10.50K / 3 Page	View it Online	Download Datasheet

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Part No.	5962H9475407QLC 5962F9475401QLA 5962F9475401QLC 5962F9475401QLX 5962F9475401QXA 5962F9475401QXC 5962F9475401QYA 5962F9475401QXX 5962F9475401QYC 5962F9475401QYX 5962F9475401VLA 5962F9475401VLC 5962F9475401VLX 5962F9475401VXA 5962F9475401VXC 5962F9475403QYX 5962F9475402QYX 5962F9475404QYX 5962F9475406QYX 5962F9475405QYX 5962F9475405VLA 5962F9475405VLC 5962F9475405VLX 5962F9475405VXA 5962F9475405VXC 5962F9475405VXX 5962G9475401QLC 5962G9475401QLX 5962G9475401QLA 5962G9475401QXA 5962G9475401QXC 5962G9475401QXX 5962F9475402QLC 5962F9475403QLC 5962F9475406QLC 5962F9475408QLC 5962G9475402QLC 5962G9475403QLC 5962G9475404QLC 5962G9475406QLC 5962G9475407QLC 5962H9475403QLC 5962H9475404QLC 5962H9475405QLC 5962H9475406QLC 5962R9475402QLC 5962R9475405QLC 5962F9475405QLC 5962H9475401QLC 5962R9475401QLC 5962F9475407QLC 5962R9475404QLC 5962F9475404QLC 5962G9475405QLC 5962H9475408QLC 5962F9475401VYC 5962F9475402QYA 5962F9475402QLX 5962F9475402QXX 5962F9475402QXA 5962R9475401VYX 5962R9475401QYX 5962R9475401QYA 5962R9475401VLC 5962R9475401VYC 5962R9475401QXX 5962R9475401QYC 5962R9475401QLA 5962R9475401VXX 5962R9475401QXA 5962R9475401VLA 5962R9475401VLX 5962F9475406VLX 5962F9475406VLC 5962R9475406VLX
Description	Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class G. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional. Radiation hardened PAL: SMD. total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold. Radiation hardened PAL: SMD. total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional. Radiation hardened PAL: SMD. total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish gold.
File Size	199.46K / 19 Page	View it Online	Download Datasheet

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Part No.	UT80CRH196KDS-WCA UT80CRH196KDS-WCC UT80CRH196KDS-WCX UT80CRH196KDS-WPC 5962R0252301VXA 5962R0252301VXC 5962R0252301VXX 5962R0252302VXC 5962R0252302VXA 5962R0252302VXX 5962R0252302QXC
Description	Microcontroller. Lead finish solder. Microcontroller. Lead finish gold. Microcontroller. Lead finish optional. Microcontroller. Lead finish gold. Prototype. 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish solder. total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish gold. total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish optional. total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class Q, 20MHz. Lead finish gold. total dose 1E5 rads(Si).
File Size	178.93K / 43 Page	View it Online	Download Datasheet

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Part No.	5962H3829435BNC 5962H3829435BNX 5962H3829435BXA 5962H3829435BXC 5962H3829435BXX 5962H3829435SNA 5962H3829435SNC 5962H3829435SNX 5962H3829435SXA 5962H3829435SXC 5962H3829436BNA 5962H3829436BNC 5962H3829436BNX 5962H3829436BXA 5962H3829436BXC 5962H3829436BXX 5962H3829436SNA 5962H3829436SNC 5962H3829436SNX 5962H3829436SXA 5962H3829436SXC 5962H3829436SXX 5962H3829437BNA 5962H3829437BNC 5962H3829437BXC 5962H3829437BXX 5962R3829435BNX 5962R3829436BNX 5962R3829437BNX 5962R3829435SNA 5962R3829435SNC 5962R3829435SNX 5962H3829437SNC 5962R3829436SNC 5962R3829437SNC 5962H3829437SXX 5962R3829435SXX 5962R3829437SXX 5962R3829436SXX 5962R3829436SNA 5962R3829436SNX 5962R3829436SXA 5962R3829435BNA 5962R3829435BNC 5962R3829437BNC 5962R3829437BNA 5962R3829435SXC 5962R3829435SXA 5962R3829437SNX 5962H3829437SNX 5962R3829436BNA 5962R3829437SXC 5962R3829437SXA 5962H3829437SXC 5962H3829437SXA 5962R3829435BXA 5962R3829435BXX 5962R3829435BXC 5962H3829437SNA 5962R3829436BXA 5962R3829437BXX
Description	Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class Q. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class V. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 75ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class Q. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 75ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class Q. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class V. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 75ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class V. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 75ns access time. QML class V. Lead finish optional. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 75ns access time. QML class V. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 85ns access time. QML class Q. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class Q. Lead finish gold. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 75ns access time. QML class Q. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 5E5 rads(Si). 55ns access time. QML class V. Lead finish solder. Radiation-hardened 8Kx8 SRAM: SMD. total dose 1E6 rads(Si). 55ns access time. QML class V. Lead finish solder.
File Size	99.86K / 15 Page	View it Online	Download Datasheet

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Part No.	5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 5962D0053601TXC 5962D0053602QXA 5962D0053602TUC 5962D0053602QXC 5962D0053603QUA 5962D0053601TUA 5962D0053601QXX 5962D0053601TUC 5962D0053601TUX 5962D0053602TUX 5962D0053602QUX 5962D0053602TXX 5962D0053602QXX 5962D0053602QUA 5962D0053601QXA 5962D0053601TXX 5962D0053602QUC 5962D0053602TXC 5962D0053601QXC 5962D0053602TUA 5962D0053601QUX 5962D0053601QUC 5962D0053603QUX 5962D0053603QXA 5962D0053603QXX 5962D0053603QXC 5962D0053603QUC UT9Q512-IWX UT9Q512-IWC UT9Q512-20ICC UT9Q512-20ICX UT9Q512-20IPC UT9Q512-20IWC UT9Q512-20UCC UT9Q512-20UCA UT9Q512-20UCX UT9Q512-20UWA UT9Q512-ICA UT9Q512-IPC UT9Q512-20ICA UT9Q512-20IWA UT9Q512-20IWX UT9Q512-20UPC UT9Q512-20UWC UT9Q512-20UWX UT9Q512-ICC UT9Q512-ICX UT9Q512-IWA UT9Q512-UCA 5962D0053603TXC 5962D0053604TXC 5962L0053601TXC 5962L0053602TXC 5962L0053603TXC 5962L0053604TXC 5962P0053601TXC 5962P0053602TXC 5962P0053603TXC 5962P0053604TXC 5962L0053601QUA 5962L0053601QUC 5962L0053601QUX 5962L0053601QXA 5962L0053601QXC 5962L0053601QXX 5962L0053601TUA 5962L0053601TUC 5962L0053601TUX 5962L0053601TXX 5962L0053602QUA 5962L0053602QUC 5962L0053602QUX 5962L0053602QXA 5962L0053602QXC 5962L0053602TUA 5962L0053602
Description	512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. total dose 3E4(30krad(Si)).
File Size	128.60K / 15 Page	View it Online	Download Datasheet

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