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				Central Semiconductor Corp Central Semiconductor C...
Part No.	CPD34X
OCR Text	...ss details die size 85 x 85 mils die thickness 5.9 mils 0.8 mils anode bonding pad area 78 x 78 mils top side metalization al ? 30,000? back side metalization ti/ni/au - 1,600?/5,550?/1,500? principal device type cshd10...
Description	10 Amp Schottky Rectifier Chip
File Size	540.10K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CPD79
OCR Text	...tifier chip die size 49 x 49 mils die thickness 9.8 mils anode bonding pad area 39 x 39 mils top side metalization al/ni/au - 30,000?/3,000?/1,500? back side metalization ti/ni/au - 1,600?/5,500?/1,600? www.centralsemi.com r0...
Description	2 Amp Schottky Rectifier Chip
File Size	681.10K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP59310
OCR Text	...ial planar die size 19 x 19 mils die thickness 9.0 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.5 mils top side metalization al - 30,000? back side metalization au - 18,000? www.centrals...
Description	Small Signal Transistor PNP - Amp/Switch Transistor Chip
File Size	415.70K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP595
OCR Text	...itaxial planar die size 30 x 30 mils die thickness 7.0 mils base bonding pad area 8.0 x 8.0 mils emitter bonding pad area 7.6 x 7.6 mils top side metalization al - 30,000 ? back side metalization au - 10,000? gross die per 4 inch w afer 12,...
Description	Small Signal Transistor PNP - High Voltage Transistor Chip
File Size	200.56K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP593
OCR Text	...axial planar die size 19 x 19 mils die thickness 9.0 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.5 mils top side metalization al - 30,000? back side metalization au - 18,000? process details 145 adams ave...
Description	Small Signal Transistors PNP - Amp/Switch Transistor Chip
File Size	46.90K / 1 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP591V10
OCR Text	...ial planar die size 19 x 19 mils die thickness 7.1 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.5 mils top side metalization al - 30,000? back side metalization au - 18,000? backside col...
Description	Small Signal Transistor PNP - Amp/Switch Transistor Chip
File Size	398.03K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP592V
OCR Text	...itaxial planar die size 12 x 20 mils die thickness 7.1 mils base bonding pad area 3.6 x 3.6 mils emitter bonding pad area 3.6 x 3.6 mils top side metalization al - 30,000? back side metalization au - 18,000? process details 145 adams ave...
Description	Small Signal Transistors PNP - Amp/Switch Transistor Chip
File Size	188.49K / 2 Page	View it Online	Download Datasheet

For mils Found Datasheets File :: 5811 Search Time::1.61ms
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