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For glue Found Datasheets File :: 2428    Search Time::1.109ms    
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    1ML06-031-05

RMT Ltd.
Part No. 1ML06-031-05
OCR Text ...ermoconductive properties. a glue is usually based on some epoxy compound filled with some thermoconductive material such as graphite or diamond powders, silver, sin and others. the application of a specific type depends ...
Description Thermoelectric Module

File Size 817.51K  /  13 Page

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    LPC47M172 LPC47M172-NR

SMSC[SMSC Corporation]
Part No. LPC47M172 LPC47M172-NR
OCR Text glue Logic Datasheet Product Features 3.3V Operation (5V tolerant) LPC Interface - Multiplexed Command, Address and Data Bus - Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems Enhanced Digital Data Separa...
Description ADVANCED I/O CONTROLLER WITH MOTHERBOARD glue LOGIC

File Size 1,247.10K  /  227 Page

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    LPC47M182 LPC47M182-NR LPC47M182-NW

SMSC[SMSC Corporation]
Part No. LPC47M182 LPC47M182-NR LPC47M182-NW
OCR Text glue Logic Datasheet Product Features 3.3V Operation (5V tolerant) LPC Interface - Multiplexed Command, Address and Data Bus - Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems Enhanced Digital Data Separa...
Description ADVANCED I/O CONTROLLER WITH MOTHERBOARD glue LOGIC

File Size 1,216.42K  /  223 Page

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    TSLG-XR8080-A08L TSLG-XR8080-A08L-92-TR70

TAITRON Components Incorporated
Part No. TSLG-XR8080-A08L TSLG-XR8080-A08L-92-TR70
OCR Text ...rocess flow Thermal conductive glue dispensing Recommended material and its supplier: EpoTek T7109 from Epoxy Technology LED emitter placement Hot bar soldering of LED emitter Note: The MCPCB should be preheated up to 40C for increas...
Description HIGH POWER LED

File Size 308.26K  /  9 Page

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    1LWP2300 5TH21000 5TH23000

celduc-relais
Part No. 1LWP2300 5TH21000 5TH23000
OCR Text ...ermal PAD. 36.8mm 36.8mm glue on both edges 5TH23000 Page 1/5 celduc thermal pads performances : 5THxxxx thermal PAD is a thermally conductive phase change material coated on both sides of aluminium foil. At temperatures gr...
Description THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use

File Size 400.51K  /  5 Page

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    ISPGDX80A-5T100 ISPGDX80A-7T100

Lattice Semiconductor
Part No. ISPGDX80A-5T100 ISPGDX80A-7T100
OCR Text ...r buses, but standard data path glue components still relegated primarily to eight bits, PCBs are frequently crammed with a dozen or more data path glue chips that use valuable real estate. Many of these applications consist of "on-board" b...
Description In-System Programmable Generic Digital Crosspoint

File Size 224.47K  /  23 Page

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    WSI
Part No. PSD303
OCR Text ...t of discrete PALs (R) t "No glue" Microcontroller Chip-Set -- -- -- -- Built-in address latches for multiplexed address/data bus Non-multiplexed address/data bus mode ALE and Reset (non-PSD3XXL versions) polarity programmable Selectabl...
Description 在系统可编程微控制器外围器件,16K位SRAM,19个可编程I/O,通用PLD有16个输入
From old datasheet system

File Size 667.59K  /  127 Page

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    1ML06-029-05 1ML06-029-09 1ML06-029-12

RMT Ltd.
Part No. 1ML06-029-05 1ML06-029-09 1ML06-029-12
OCR Text ...ermoconductive properties. a glue is usually based on some epoxy compound filled with some thermoconductive material such as graphite or diamond powders, silver, sin and others. the application of a specific type depends ...
Description Thermoelectric Module

File Size 927.33K  /  13 Page

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