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  cooling Datasheet PDF File

For cooling Found Datasheets File :: 19016    Search Time::1.469ms    
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    DCR390J85 DCR390J80 DCR390J70

Dynex Semiconductor
Part No. DCR390J85 DCR390J80 DCR390J70
OCR Text ... features ? double side cooling ? high surge capability applications ? high power drives ? high voltage power supplies ? static switches voltage ratings part and ordering number repetitive peak ...
Description Phase Control Thyristor

File Size 387.31K  /  10 Page

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    PSPRL9802 PSPRL9802SA PSPRL9802SB PSPRL9802SC PSPRL9802SD PSPRL9802SE

Wall Industries,Inc.
Part No. PSPRL9802 PSPRL9802SA PSPRL9802SB PSPRL9802SC PSPRL9802SD PSPRL9802SE
OCR Text ...tion-Cooled and with Forced Air cooling Rating Options Protections: Short Circuit/ Over Load/ Over Voltage/ Over Temp SPECIFICATIONS: PSPRL9802 Series All specifications are based on 25 C, Nominal Input Voltage, and Maximum Output Cu...
Description Active PFC 200 Watt Single Output AC/DC Switching Power Supply

File Size 204.76K  /  3 Page

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    IRF6612TRPBF IRF6612PBF IRF66121PBF IRF6612PBF-15 IRF661TRPBF

International Rectifier
Part No. IRF6612TRPBF IRF6612PBF IRF66121PBF IRF6612PBF-15 IRF661TRPBF
OCR Text ... profile (<0.7mm) dual sided cooling compatible compatible with existing surface mount techniques description the irf6612pbf combines the latest hexfet? power mosfet silicon technology with the advanced directfet tm packag- ing...
Description RoHs Compliant
Ideal for CPU Core DC-DC Converters

File Size 238.58K  /  10 Page

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    PSPW120 PSPW120B-1Y12P PSPW120B-1Y15P PSPW120B-1Y18P PSPW120B-1Y19P PSPW120B-1Y24P

Wall Industries,Inc.
Part No. PSPW120 PSPW120B-1Y12P PSPW120B-1Y15P PSPW120B-1Y18P PSPW120B-1Y19P PSPW120B-1Y24P
OCR Text ........................ 0.04% / C cooling..................................................... free air convection MTBF......... 80,000 hrs at full load and 25C ambient temperature OUTPUT SPECIFICATIONS Output Current........................
Description 120 Watts with PFC AC/DC Open Frame Power Supply

File Size 118.54K  /  2 Page

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    BAS40-04LT1 ON0119

Motorola, Inc.
ON Semiconductor
Part No. BAS40-04LT1 ON0119
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description Dual Series Schottky Diode(高速开关应用,-0.50V正向电压,反向电0V的双肖特基势垒二极管)
From old datasheet system
SCHOTTKY BARRIER DIODES

File Size 73.00K  /  4 Page

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    BAS40-06LT1 BAS40-06LT1/D

ON Semiconductor
Part No. BAS40-06LT1 BAS40-06LT1/D
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description PSoC® Mixed-Signal Array
SCHOTTKY BARRIER DIODE

File Size 74.38K  /  4 Page

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    BAS4004LT1

Motorola, Inc.
Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS4004LT1
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description CASE 318 08/ STYLE 12 SOT 23 (TO 236AB)
CASE 318 08, STYLE 12 SOT 23 (TO 236AB)

File Size 73.08K  /  4 Page

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    BAS4006LT1

Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS4006LT1
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description CASE 318-08/ STYLE 11 SOT-23 (TO-236AB)
CASE 318-08, STYLE 11 SOT-23 (TO-236AB)

File Size 74.33K  /  4 Page

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    BAS40LT1 ON0121 BAS4

Motorola Mobility Holdings, Inc.
Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BAS40LT1 ON0121 BAS4
OCR Text ...at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cool...
Description CASE 318-08, STYLE 8 SOT-23 TO-236AB SILICON, SIGNAL DIODE, TO-236AB
CASE 318-08/ STYLE 8 SOT-23 TO-236AB
From old datasheet system

File Size 71.42K  /  4 Page

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