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Molex Electronics Ltd.
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| Part No. |
0757575141 75757-5141
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
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| File Size |
166.21K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10127720-221LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 22 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-0221PLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 2 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0757575221 75757-5221
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
166.27K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68022-114HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68022-170HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68022-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68602-214HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86130602214345E1LF
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| Description |
8613 M CNR LF
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0331 0757570331
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
86130102214345E1LF
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| Description |
8613 M CNR LF
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68002-218HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0332 0757570332
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68402-213LF
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| Description |
Dubox, Board to board connector, PCB Mounted Receptacle, Surface Mount, Dual Entry, Single Row, 13 Position, 2.54mm (0.100in) Pitch.
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Official Product Page
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Bom2Buy.com
Price and Availability
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