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Amphenol Communications Solutions |
Part No. |
54122-818321850LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-428-18LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-109281800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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SEME-LAB[Seme LAB]
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Part No. |
2N2894 2N2818 2N2823 2N2892
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Description |
5-Pin µP Supervisory Circuits with Watchdog and Manual Reset PNP SILICON TRANSISTOR TRANSISTOR | BJT | NPN | 200V V(BR)CEO | 20A I(C) | STR-5/16 TRANSISTOR | BJT | NPN | 80V V(BR)CEO | 30A I(C) | STR-5/16
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File Size |
15.48K /
2 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-818341000LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Harwin PLC
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Part No. |
D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818-01 D2820-01 D2832-21
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Description |
2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET 2.54mm Pitch Dual Row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
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File Size |
204.26K /
1 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-109281850LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
75188-828-18LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical header, Through Hole, Single Row, 18 Positions, 5.08mm (0.200in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0444281802 44428-1802
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Description |
3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits, 0.38μm (15μ) Gold MOLEX Connector
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File Size |
232.93K /
4 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54112-818122250LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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Part No. |
SD-94240-003 0942402818
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Description |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole, SPS, Vertical, 18 Circuit, Black 2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole, SPS, Vertical, 18 Circuit, Black
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File Size |
117.58K /
3 Page |
View
it Online |
Download Datasheet
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Price and Availability
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