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  85013-2282 Datasheet PDF File

For 85013-2282 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    85013-3122 0850133122

Molex Electronics Ltd.
Part No. 85013-3122 0850133122
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850132127 85013-2127

Molex Electronics Ltd.
Part No. 0850132127 85013-2127
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free

File Size 159.01K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850133225 85013-3225

Molex Electronics Ltd.
Part No. 0850133225 85013-3225
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 64 Circuits, Lead free

File Size 125.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3093 0850133093

Molex Electronics Ltd.
Part No. 85013-3093 0850133093
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits

File Size 146.04K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3081 0850133081

Molex Electronics Ltd.
Part No. 85013-3081 0850133081
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits

File Size 146.73K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-1108 0850131108

Molex Electronics Ltd.
Part No. 85013-1108 0850131108
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse, 0.6um (24u) Selective Gold (Au)

File Size 130.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-828201150LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    85013-3043 0850133043

Molex Electronics Ltd.
Part No. 85013-3043 0850133043
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Press-Fit Style R Male, 32 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, 3-Row C-Pin, Press-Fit Style R Male, 32 Circuits

File Size 154.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-112282100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0850132000 85013-2000

Molex Electronics Ltd.
Part No. 0850132000 85013-2000
Description 2.54mm (.100) Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R/2 Reverse, 32 Circuits

File Size 114.75K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-112282200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 28 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0850132012 85013-2012

Molex Electronics Ltd.
Part No. 0850132012 85013-2012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse1渭m (40渭") Selective Gold (Au), 48 Circuits, Lead free

File Size 267.35K  /  8 Page

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Amphenol Communications Solutions

Part No. 54122-820142000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0850133213 85013-3213

Molex Electronics Ltd.
Part No. 0850133213 85013-3213
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.74K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-820162000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

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