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  54559-1611 Datasheet PDF File

For 54559-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    MGA-16116-BLKG MGA-16116-TR1G

AVAGO TECHNOLOGIES LIMITED
Broadcom Corporation.
Part No. MGA-16116-BLKG MGA-16116-TR1G
Description Dual LNA for Balanced Application 450 ?1450 MHz
   Dual LNA for Balanced Application 450 ?1450 MHz

File Size 530.82K  /  17 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    053513-1611

ITT Industries
Part No. 053513-1611
Description Combo D Series: D-Subminiature offering mixed layouts

File Size 29.33K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    W91610 W91611

Winbond Electronics Corp
Part No. W91610 W91611
Description TONE/PULSE DIALER WITH TWO-STAGE REDIAL FUNCTION

File Size 160.05K  /  12 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

    RN1611 RN1610

TOSHIBA[Toshiba Semiconductor]
Part No. RN1611 RN1610
Description TOSHIBA Transistor Silicon Npn Epitaxial Type (PCT Process)

File Size 165.83K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021611-00006T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 6 contacts
Tech specs    

Official Product Page

    2SA1611-T1

NEC
Part No. 2SA1611-T1
Description Silicon transistor

File Size 199.68K  /  5 Page

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Amphenol Communications Solutions

Part No. 10131319-16111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16116-02
Description 9600 bps FAX MODEM(9600bps传真调制解调 9600 bps的传真调制解调器9600bps的传真调制解调器

File Size 25.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00050T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 50 contacts
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16118
Description 9600bps FAX super one-chip(9600bps传真调制解调 9600bps传真超级单芯片(9600bps传真调制解调器)

File Size 27.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 68016-113HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 13 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    TY Semiconductor Co., Ltd
Part No. 2SD1611
Description High forward current transfer ratio hFE High collector-base voltage (Emitter open) VCBO

File Size 107.98K  /  2 Page

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Amphenol Communications Solutions

Part No. 20021611-00026T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs    

Official Product Page

    Panasonic
Part No. 2SD1611
Description Power Device - Power Transistors - General-Purpose power amplification

File Size 84.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021611-00044T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 44 contacts
Tech specs    

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    SHENZHEN YONGERJIA INDUSTRY CO.,LTD
Part No. 2SA1611
Description TRANSISTOR (PNP)

File Size 136.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-807161100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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