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Amphenol Communications Solutions |
Part No. |
52089-203LF
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Description |
SOFIX® Power Connectors, Power Connectors, Shielded I/O Header 2x4-PIP .
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Tech specs |
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Official Product Page
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Toshiba Electronic Devices & Storage Corporation |
Part No. |
TLP2719
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Description |
Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 5000 Vrms, SO6L
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
86094327194758E1LF
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Description |
Din Headers and Receptacles, Backplane connectors, Right Angle Header Press-Fit Style C 32 ways, Class II
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-827-19LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-127-19LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-127-19
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-427-19LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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