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  43045-2229 Datasheet PDF File

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    43045-0609

Molex Electronics Ltd.
Part No. 43045-0609
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 6 Circuits
File Size 176.76K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-0614

Molex Electronics Ltd.
Part No. 43045-0614
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

    43045-0608

Molex Electronics Ltd.
Part No. 43045-0608
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 6 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 10122297-126008LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , Polarized, 26 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-0802

Molex Electronics Ltd.
Part No. 43045-0802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 8 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-822-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0606

Molex Electronics Ltd.
Part No. 43045-0606
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 6 Circuits
File Size 184.20K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-422-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    43045-0602

Molex Electronics Ltd.
Part No. 43045-0602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 70232-229LF
Description 4 Row Signal Header, 24 Position, Straight, Press-Fit, Wide body
Tech specs 　 　

Official Product Page

    43045-0612

Molex Electronics Ltd.
Part No. 43045-0612
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 10122297-210007LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , Polarized, 10 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-0601

Molex Electronics Ltd.
Part No. 43045-0601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 88902-229LF
Description 5 Row Signal Header, Straight, Press-Fit, Wide body, 30 Position
Tech specs 　 　

Official Product Page

    43045-0600

Molex Electronics Ltd.
Part No. 43045-0600
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 10122297-210002LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , Polarized, 10 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-122-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

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