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Amphenol Communications Solutions |
Part No. |
77311-427-33LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-827-33LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-127-33LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
XPBL-2733B1-10D
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Description |
25G BIDI SFP+ LR
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
XPBL-2733B1-10DA
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Description |
25G BIDI SFP+ LR I Temp
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Tech specs |
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Official Product Page
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Mosel Vitelic, Corp. MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
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Part No. |
V827332N04S
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Description |
2.5 VOLT 32M x 72 HIGH PERFORMANCE REGISTERED ECC DDR SDRAM MODULE
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File Size |
295.99K /
15 Page |
View
it Online |
Download Datasheet
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Price and Availability
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