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  wbga Datasheet PDF File

For wbga Found Datasheets File :: 63    Search Time::1.391ms    
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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R271669F
OCR Text ...or up to 800mhz operation ? wbga package(54 balls) the 128mbit rdram devices ar e offered in a horizontal center-bond fanout csp package. key timing parameters/part numbers figure 1: direct rdram csp package organization speed part n...
Description 128Mbit RDRAM(F-die)

File Size 293.32K  /  20 Page

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    V54C365164VD V54C365164

MOSEL[Mosel Vitelic, Corp]
Part No. V54C365164VD V54C365164
OCR Text ... 56 Ball Grid Array (or BGA) wbga SDRAM (X4/X8/X16) 56 PINS ASSIGNMENT (Top View) X4 X8 VSS VSSQ DQ6 NC VSSQ DQ4 NC NC CLK - A9 A7 A5 VSS DQ15 DQ14 VDDQ DQ11 DQ10 VDDQ VSS UDQM CKE A11 A8 A6 A4 NC VSS VSSQ DQ13 DQ12 VSSQ DQ9 DQ8 NC CLK ...
Description HIGH PERFORMANCE 225/200/166/143 MHz 3.3 VOLT 4M X 16 SYNCHRONOUS DRAM 4 BANKS X 1Mbit X 16

File Size 614.70K  /  56 Page

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    IS43DR32800A-37CBL IS43DR32800A-37CBLI IS43DR32800A-37CBL-TR IS43DR32800A-37CBLI-TR

天津新技术产业园区管理委员会
Integrated Silicon Solution, Inc
Part No. IS43DR32800A-37CBL IS43DR32800A-37CBLI IS43DR32800A-37CBL-TR IS43DR32800A-37CBLI-TR
OCR Text ...efresh) ? package: x32: 126 wbga ? timing C cycle time 3.0ns @cl=5, ddr2-667d 3.75ns @cl=4, ddr2-533c 5.0ns @cl=3, ddr2-400b ? temperature range: commercial (0c tc 85c; 0c t a 70c) industrial (C40c tc 95c; C40c ...
Description 256Mb DDR2 DRAM

File Size 772.53K  /  41 Page

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    天津新技术产业园区管理委员会
Part No. IS43DR83200A-37CBLI IS43DR83200A-37CBLI-TR
OCR Text ... (8mm x 10.5mm) x16: 84-ball wbga (8mm x 12.5mm) timing C cycle time 2.5ns @cl=6 ddr2-800e 3.0ns @cl=5 ddr2-667d 3.75ns @cl=4 ddr2-533c 5.0ns @cl=3 ddr2-400b ? temperature range: commercial (0c tc 85c) industrial (-40c ...
Description
File Size 1,002.35K  /  48 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
OCR Text ...mn buses for higher efficiency wbga lead free package (92 balls) (5.25" x 1.375" x 0.05") banks on 1.1GB module Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB. Figure 1: RIMM Module shown ...
Description (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V
(32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V

File Size 256.70K  /  14 Page

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    MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF0 MR16R1624AF0 MR16R1628AF0 MR16R1622AF0 MR16R1624AF0-CK8 MR16R1624AF0

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF0 MR16R1624AF0 MR16R1628AF0 MR16R1622AF0 MR16R1624AF0-CK8 MR16R1624AF0-CM8 MR18R1628AF0-CK8 MR18R1628AF0-CM8 MR18R1628AF1-CN9 MR18R1628AF1-CT9 MR18R1622AF0-CK8 MR18R1622AF0-CM8 MR18R162GAF0-CK8 MR18R162GAF0-CM8 MR18R162GAF0-CN9 MR18R162GAF0-CT9 MR18R1624AF0-CK8 MR18R1624AF0-CM8 MR18R1624AF1-CN9 MR18R1624AF1-CT9 MR16R1622AF0-CK8 MR16R1622AF0-CM8 MR16R162GAF0-CK8 MR16R162GAF0-CM8 MR16R1628AF0-CK8 MR16R1628AF0-CM8
OCR Text ...mn buses for higher efficiency wbga package (92 balls) Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB. Figure 1: RIMM Module shown with heat spreader removed Page 1 Version 1.4 July 2002 ...
Description 64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V
16Mx16显示)2/8/16)件RIMM的模块,基于256Mb阿芯片,32秒银行,16K/32ms参考,.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V

File Size 417.13K  /  16 Page

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    K4R271669F

SAMSUNG[Samsung semiconductor]
Part No. K4R271669F
OCR Text ...ace for up to 800MHz operation wbga package(54 Balls) Page 1 Version 1.41 Jan. 2004 K4R271669F Pinouts and Definitions The following table shows the pin assignments of the centerbonded RDRAM package. Table 1: Center-Bonded CSP D...
Description 128Mbit RDRAM(F-die)

File Size 289.35K  /  20 Page

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    Mosel Vitelic, Corp.
Part No. V55C2128164VT V55C2128164VB
OCR Text ...itelic v55c2128164v(t/b) 60 pin wbga pin configuration top view description pkg. pin count bga b 54 v 55 c 2 12816 4 s x b mosel vitelic manufactured low power synchronous dram c=cmos family 2.5v supply voltage 128mb(...
Description 128Mbit LOW-POWER SDRAM 2.5 VOLT, TSOP II / BGA PACKAGE 8M X 16

File Size 522.22K  /  44 Page

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    Mosel Vitelic, Corp.
Part No. V55C2128164V
OCR Text ...itelic v55c2128164v(t/b) 60 pin wbga pin configuration top view description pkg. pin count bga b 54 v 55 c 2 12816 4 s x b mosel vitelic manufactured low power synchronous dram c=cmos family 2.5v supply voltage 128mb(...
Description 128Mbit LOW-POWER SDRAM 2.5 VOLT, TSOP II / BGA PACKAGE 8M X 16

File Size 525.77K  /  44 Page

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    MR18R1628EG0-CM8 MR16R1628EG0-CK8 MR16R162GEG0-CK8 MR16R16248EG0 MR16R1624EG0-CK8 MR16R1624EG0-CM8 MR16R1624EG0-CT9 MR16

Samsung Electronic
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. MR18R1628EG0-CM8 MR16R1628EG0-CK8 MR16R162GEG0-CK8 MR16R16248EG0 MR16R1624EG0-CK8 MR16R1624EG0-CM8 MR16R1624EG0-CT9 MR16R1624GEG0 MR16R162GEG0-CM8 MR16R162GEG0-CT9 MR18R1624EG0-CK8 MR18R1624EG0-CM8 MR18R1624EG0-CT9 MR18R1624GEG0 MR18R1628EG0-CK8 MR18R1628EG0-CT9 MR18R162GEG0-CK8 MR18R162GEG0-CM8 MR18R162GEG0-CT9 MR18R16248EG0 MR16R1628EG0-CM8 MR16R1628EG0-CT9
OCR Text ...mn buses for higher efficiency wbga lead free package (92/84 balls) Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB. Figure 1: RIMM Module shown with heat spreader removed Page 1 Version 1.0 ...
Description From old datasheet system
CONN HEADER 20POS DL PCB 30GOLD
Key Timing Parameters 关键的定时参
CONN HEADER 18POS DL PCB 30GOLD 关键的定时参

File Size 439.82K  /  16 Page

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For wbga Found Datasheets File :: 63    Search Time::1.391ms    
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