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For rework Found Datasheets File :: 1315 Search Time::1.047ms
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				FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA096607 RMPA0966
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no...
Description	WCDMA Band V Power Amplifier Module
File Size	180.07K / 7 Page	View it Online	Download Datasheet

				Gennum Corporation
Part No.	GS9062 GS9060 GS1532 GS1560
OCR Text	.............................6 3.3 rework or repair ............................................................................................6 3.4 endurance to warp ............................................................................
Description	HD-LINX II Voltage Controlled Oscillator
File Size	146.94K / 9 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	NBSG11 NBSG111 NBSG11BA NBSG53A NBSG53ABA NBSG53AMN NBSG53AMNR2 NBSG86A NBSG86ABA
OCR Text	...nal solder joint inspection. 7. rework process (if necessary). pcb i/o contacts plating there are two common plated solderable metallizations which are used for pcb surfaces mount devices. in both cases it is imperative that the plating is ...
Description	2.5 V/3.3 V SiGe 1:2 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe 1:10 Differential Clock Driver with RSECL Outputs 2.5 V/3.3 V SiGe Selectable Differential Clock and Data D Flip-Flop/Clock Divider with Reset and OLS 2.5 V/3.3 V SiGe Differential Smart Gate with Output Level Select
File Size	57.39K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	IP4364CX8
OCR Text	... open circuits and voids. 9.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls...
Description	(IP4064CX8 / IP4364CX8) Integrated SIM card passive filter array
File Size	116.61K / 13 Page	View it Online	Download Datasheet

				FAIRCHILD SEMICONDUCTOR CORP FAIRCHILD[Fairchild Semiconductor]
Part No.	RMPA2263
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no...
Description	WCDMA Power Amplifier Module 1920-1980 MHz
File Size	108.75K / 7 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN1235
OCR Text	...cally 5 minutes). vi.4 - manual rework flip-chips are able to tolerate one repair in addition to the two reflows mentionned in section vi.2. as for other bga type packages, the use of laser systems is the most suitable form for flip-chip re...
Description	FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
File Size	85.46K / 8 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	AN610
OCR Text	...h void levels less than 25%. c) rework: Using the worst-case locations from the Xray inspection results, six PCBs and two locations on each board were selected and marked "X" with indelegable black ink for rework. The originally soldered pa...
Description	PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701
File Size	1,196.47K / 17 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA0963
OCR Text	...nd be a consistent thickness. rework considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. the device should not be subjected to more than 225c and reflow solder in the molten state for...
Description	Cellular CDMA CDMA2000-1X and WCDMA Power Amplifier Module
File Size	145.31K / 7 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	IP4338CX24LF
OCR Text	... open circuits and voids. 9.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls...
Description	10-channel integrated filter network
File Size	102.72K / 12 Page	View it Online	Download Datasheet

				http:// FAIRCHILD[Fairchild Semiconductor]
Part No.	FMPA215107 FMPA2151
OCR Text	... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no...
Description	2.4-2.5GHz and 4.9-5.9GHz Dual Band Linear Power Amplifier Module
File Size	514.53K / 5 Page	View it Online	Download Datasheet

For rework Found Datasheets File :: 1315 Search Time::1.047ms
Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |