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BD3150S 04150 D2136 102MP M67730L RT9605B CAT25 DMC16105
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For mils Found Datasheets File :: 5811    Search Time::2.11ms    
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    CPD106R

Central Semiconductor Corp
Part No. CPD106R
OCR Text ...s details die size 8.3 x 8.3 mils die thickness 3.9 mils anode bonding pad area 5.4 x 5.4 mils top side metalization al - 30,000? back side metalization au - 12,000? www.centralsemi.com r0 (20-april 2011) process cpd10...
Description Schottky Diode Chip

File Size 616.99K  /  2 Page

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    CP388X

Central Semiconductor Corp
Part No. CP388X
OCR Text ...ial planar die size 13 x 13 mils die thickness 5.9 mils base bonding pad area 3.9 x 3.9 mils emitter bonding pad area 5.4 x 5.4 mils top side metalization al-si - 17,000? back side metalization au - 12,000? backside ...
Description Small Signal Transistor NPN - Low Noise Amplifier Transistor Chip

File Size 643.41K  /  2 Page

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    CPQ166

Central Semiconductor Corp
Part No. CPQ166
OCR Text ...ted mesa die size 165 x 165 mils die thickness 9.1 mils 0.4 mils mt1 bonding pad area 134 x 100 mils gate bonding pad area 28 x 28 mils top side metalization al - 45,000? back side metalization al/mo/ni/ag - 32,000?...
Description 25 Amp, 600 Volt TRIAC Chip

File Size 167.48K  /  1 Page

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    CP591X

Central Semiconductor Corp
Part No. CP591X
OCR Text ...ial planar die size 19 x 19 mils die thickness 5.9 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.5 mils top side metalization al - 13,000? back side metalization au - 18,000? backside col...
Description Small Signal Transistor PNP - Amp/Switch Transistor Chip

File Size 397.89K  /  2 Page

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    CP591V

Central Semiconductor Corp
Part No. CP591V
OCR Text ...itaxial planar die size 19 x 19 mils die thickness 7.1 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.5 mils top side metalization al - 30,000? back side metalization au - 18,000? process details 145 adams av...
Description Small Signal Transistor PNP - Amp/Switch Transistor Chip

File Size 209.63K  /  2 Page

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    CPD66X

Central Semiconductor Corp
Part No. CPD66X
OCR Text ...details die size 17.5 x 17.5 mils die thickness 5.9 mils anode bonding pad area 7.9 mils diameter top side metalization al - 30,000? back side metalization au-as - 13,000? www.centralsemi.com r1 (19-july 2010) process ...
Description Low Leakage Diode Low Leakage Diode Chip

File Size 722.64K  /  2 Page

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    CPZ40X

Central Semiconductor Corp
Central Semiconductor C...
Part No. CPZ40X
OCR Text ...details die size 13.4 x 13.4 mils die thickness 5.5 mils cathode bonding pad area 3.9 x 6.7 mils top side metalization al - 30,000? back side metalization au - 9,000? www.centralsemi.com r0 (9-january 2013) process cpz...
Description 5 Volt TVS Chip

File Size 589.84K  /  2 Page

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    CP191V

Central Semiconductor Corp
Part No. CP191V
OCR Text ...planar die size 16.5 x 16.5 mils die thickness 7.1 mils base bonding pad area 3.5 x 4.3 mils emitter bonding pad area 3.5 x 4.3 mils top side metalization al - 30,000? back side metalization au-as - 13,000? www.centr...
Description Small Signal Transistor NPN - Amp/Switch Transistor Chip

File Size 476.67K  /  2 Page

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    Central Semiconductor
Part No. CP792
OCR Text ...itaxial planar die size 11 x 11 mils die thickness 7.0 mils base bonding pad area 3.7 x 3.7 mils emitter bonding pad area 3.7 x 3.7 mils top side metalization al - 30,000? back side metalization au - 18,000? gross die per 4 inch w afer 93,8...
Description Chip Form: SMALL SIGNAL TRANSISTOR

File Size 71.42K  /  1 Page

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    CP792V

Central Semiconductor Corp
Part No. CP792V
OCR Text ...ial planar die size 11 x 11 mils die thickness 7.1 mils base bonding pad area 3.7 x 3.7 mils emitter bonding pad area 3.7 x 3.7 mils top side metalization al - 30,000? back side metalization au - 18,000? backside col...
Description Smal Signal Transistor PNP - Amp/Switch Transistor Chip

File Size 644.49K  /  2 Page

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