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SGS Thomson Microelectronics
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Part No. |
AN260
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OCR Text |
...oth time and money. bending and cutting leads the first danger area is bending and cutting the le- ads. in theseprocesses it is important to avoid strai- ning the packageand particularlythearea wherethe leads enter the encapsulating resin. ... |
Description |
HANDLING AND MOUNTING ICS IN PLASTIC POWER PACKAGES
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File Size |
188.50K /
7 Page |
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SGS Thomson Microelectronics
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Part No. |
AN533
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OCR Text |
... even damage it. 1- bending and cutting leads. lead bending must be done carefully. the lead must be firmly held between the plastic package and the bending point during lead operation. if the package / lead interface is strained, the resis... |
Description |
SCR AND TRIAC THERMAL MANAGEMENT - PRECAUTIONS FOR HANDLING AND MOUNTING
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File Size |
134.87K /
17 Page |
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STANLEY ELECTRIC CO.,LT...
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Part No. |
FKY3C64X-H
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OCR Text |
...al is exposed at the tie - bar cutting part. 3. the minimum packing unit is 200 pieces. page : 2 2014.09.22 no. part name materials lead iron pb free dip soldering encapsulant epoxy resin
fky3c64x - h specifications pa... |
Description |
Lead?free soldering compatible
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File Size |
446.06K /
20 Page |
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STANLEY ELECTRIC CO.,LT...
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Part No. |
FKY3863X
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OCR Text |
...al is exposed at the tie - bar cutting part. 3. the minimum packing unit is 200 pieces. page : 2 2014.9.12 no. part name materials lead frame fe + ag plating mold resin epoxy resin
fky3863x specifications page : 3 2014... |
Description |
Lead?free soldering compatible
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File Size |
375.33K /
20 Page |
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it Online |
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Panasonic
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Part No. |
AXR51228P
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OCR Text |
...> a type/b type on board/ board cutting/ board mounting positioning boss 4b type on board not available 8a type <packing> p: embossed tape and paper reel 2 5: i/o connectors for portable equipment <no. of signal wire> 18: sil 18 c... |
Description |
Rectangular Connector
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File Size |
613.41K /
16 Page |
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it Online |
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