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| Part No. |
TL052CP
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| OCR Text |
...he doped-aluminum bonding pads. chips may be mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6) IN + IN - OFFSET N1 OFFSET N2 (3) (2) (1) (5) +
VCC+ (7) (6) OUT - (4) VCC -
63
(5)
(4)... |
| Description |
From old datasheet system
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| File Size |
1,162.02K /
65 Page |
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it Online |
Download Datasheet
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| Part No. |
VOL62
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| OCR Text |
...ided by multi-chip packaging (2 chips in a single package): LA76810 and LA76812 There is now demand for built-in delay lines (CCDs) in PAL system ICs. These products respond to this need by combining 2 chips in a single package: a bipolar c... |
| Description |
From old datasheet system
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| File Size |
17.72K /
3 Page |
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it Online |
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LITE-ON Electronics
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| Part No. |
LTD323 LTD322
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| OCR Text |
...s red series device utilize led chips which are made from algaas on a non-transparent gaas substrate. the bright red and green series devices utilize led chips which are made from gap on a transparent gap substrate. the yellow, red orange s... |
| Description |
(LTD322 / LTD323) Dual Digit Numeric LED Displays
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| File Size |
331.86K /
4 Page |
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it Online |
Download Datasheet
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