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Amphenol Communications Solutions |
Part No. |
87052-418HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87052-438HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87052-458HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-105240900LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
70524BLF
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Description |
D-Sub Accessories, Input Output connectors, Plastic Dust Cap (black) for 15 Position Female connector
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87052-402HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87052-422HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0878980554 87898-0554
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Description |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free 2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
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File Size |
1,956.76K /
22 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
87052-442HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0878980526 87898-0526
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Description |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free 2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
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File Size |
1,956.16K /
22 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
87052-462HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0878980568 87898-0568
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Description |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free 2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
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File Size |
1,180.29K /
19 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-105240800LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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