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Amphenol Communications Solutions |
| Part No. |
10131319-14111G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131319-1411100LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Agilent (Hewlett-Packard)
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| Part No. |
HEDS-8905 HEDS-8906 HEDS-9041 HEDS-9141 HEDS-9140 HEDS-9040 HEDS-9040B00
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| Description |
Three Channel Optical Incremental Encoder Modules 三通道光学增量编码器模
HEDS-9040#B00 · Three Channel Optical Incremental Encoder Modules
HEDS-9140#A00 · Three Channel Optical Incremental Encoder Modules
HEDS-9141#A00 · Three Channel Optical Incremental Encoder Modules
HEDS-9041#B00 · Three Channel Optical Incremental Encoder Modules
HEDS-8906 · Alignment Tool For 3-channel Zipper1 (HEDS-9140 Series) Module With 56mm Codewheel
HEDS-8905 · Alignment Tool For 3-channel Zipper1 (HEDS-9140 Series) Module With 28mm Codewheel
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| File Size |
318.38K /
12 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10131319-14121G0LF
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| Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-416HLF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 32 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-410H
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 20 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0449141202 44914-1202
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| Description |
3.00mm (.118) Pitch Micro-Fit 3.0 CPI?/a> Header, Dual Row, Vertical, Compliant Pin Interface, 12 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 12 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating
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| File Size |
169.89K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-109141800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-409141270LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68491-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJMG1C8449141ER
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| Description |
RJMG, Input output Connectors, 1x1 10/100 with LED
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-809141800LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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