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Total Power Internation...
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| Part No. |
MCW1041 MCW1042 MCW1043
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| OCR Text |
...4 [2x0.10] 5.08 [0.20] [3x0.10] 3x2.54 0.5 [0.02] 0.5 [0.02] 11.2 [0.44] 3.2 [0.13] 21.8 [0.86] 20.8 [0.82] 0.50 [0.02] 0.25 [0.01] 2.7 [0.11] 9.3 [0.37] 1 2 3 5 6 7 8 bottom view 2.0 [0.08] t otal power in total power international, inc to... |
| Description |
High Power Density in SIP-8 Package
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| File Size |
499.33K /
4 Page |
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SEMTECH[Semtech Corporation]
Semtech, Corp.
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| Part No. |
SFC05-4 SFC05-4TM
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| OCR Text |
...mm pitch flip chip array with a 3x2 bump grid. It measures 1.5 x 1.0 x 0.65mm. This small outline makes the SFC05-4 especially well suited for portable applications. CSP TVS devices are compatible with current pick and place equipment and a... |
| Description |
CSP TVS Flip Chip TVS Diode Array
CSP TVS Flip Chip TVS Diode Array 总警司二极管倒装芯片抑制二极管阵
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| File Size |
172.81K /
7 Page |
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it Online |
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