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Amphenol Communications Solutions |
Part No. |
10121506-320816ALF
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Description |
HPCE STD VT Receptacle 40P16S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-108081650LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54202-T0816LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex, Inc. MOLEX INC
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Part No. |
08-52-0123 08-65-0816 08-65-0812 08-65-0801
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Description |
Crimp Socket Contact; Wire Size (AWG):30-22; Contact Material:Phosphor Bronze RoHS Compliant: Yes PHOSPHOR BRONZE, TIN (100) FINISH, WIRE TERMINAL Crimp Socket Contact; Wire Size (AWG):30-22; Contact Material:Phosphor Bronze; Contact Plating:Gold PHOSPHOR BRONZE, GOLD (15) OVER NICKEL FINISH, WIRE TERMINAL KK 100 Crp Term Std 22-30 Awg SGold PHOSPHOR BRONZE, GOLD (30) OVER NICKEL FINISH, WIRE TERMINAL
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File Size |
157.82K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
57102-F08-16LF
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Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
61083-081602LF
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Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54101-S08-16
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0877601016 87760-1016
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Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free 2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tray, Lead-free
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File Size |
160.54K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
57102-G08-16
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Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-808161050LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0877600817 87760-0817
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
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File Size |
154.96K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54121-408161800LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54242-108161400LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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