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				SGS Thomson Microelectronics STMICROELECTRONICS[STMicroelectronics] 意法半导 ST Microelectronics STMicroelectronics N.V.
Part No.	ST1335 ST1355-CW4 ST1335-BD10 ST1335-BD15 ST1335-BW2 ST1335-BW4 ST1335-CD10 ST1335-CD15 ST1335-CW2 ST1335-CW4 ST1336 ST1336-BD10 ST1336-BD15 ST1336-BW2 ST1336-BW4 ST1336-CD10 ST1336-CD15 ST1336-CW2 ST1336-CW4 ST1355 ST1355-BD10 ST1355-BD15 ST1355-BW2 ST1355-BW4 ST1355-CD10 ST1355-CD15 ST1355-CW2 ST1335-CD15/XXYY ST1335-CD10/XXYY ST1336-BD10/XXYY ST1336-BD15/XXYY ST1335-BD10/XXYY ST1335-BD15/XXYY ST1355-CD15/XXYY ST1336-CD15/XXYY ST1355-BD15/XXYY ST1336-CD10/XXYY ST1355-CD10/XXYY -ST1335-BD10 -ST1355-BD15
OCR Text	... 1 1 Micromodule (D15) wafer DESCRIPTION The members of the ST1335/1336/1355 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special ...
Description	5-CONTACT MEMORY CARD IC 272 BIT EEPROM WITH ADVANCED SECURITY MECHANISMS 5V, 3.3V, ISR™ High-Performance CPLDs NX2LP DEVELOPMENT KIT KIT DEV MOBL-USB FX2LP18 MoBL® 4-Mbit (256K x 16) Static RAM MoBL® 1-Mbit (64K x 16) Static RAM MoBL® 1 Mbit (128K x 8) Static RAM MoBL® 2-Mbit (128K x 16) Static RAM (ST1335/13361355) 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms MoBL® 1-Mbit (64K x 16) Static RAM EEPROM 5V, 3.3V, ISR High-Performance CPLDs EEPROM MoBL® 4-Mbit (256K x 16) Static RAM EEPROM 5-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms 5，联系记忆卡IC 272位具有高级安全机制的EEPROM
File Size	35.28K / 3 Page	View it Online	Download Datasheet

				TI
Part No.	TPS79330YEQT
OCR Text	...LINEAR REGULATORS IN NanoStarTM wafer CHIP SCALE AND SOT23 FEATURES * * * * * * * * * 200-mA RF Low-Dropout Regulator With Enable Available in 1.8-V, 2.5-V, 2.8-V, 2.85-V, 3-V, 3.3-V, 4.75-V, and Adjustable (1.22-V to 5.5-V) High PSRR (70...
Description	ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NANOSTAR? wafer CHIP SCALE AND SOT23
File Size	435.26K / 19 Page	View it Online	Download Datasheet

				OKI electronic components OKI[OKI electronic componets] Micro Electronics
Part No.	MG73P MG75P MG113P MG114P MG115P MG74P
OCR Text	...) VDD and VSS pads dedicated to wafer probing Separate power bus for output buffers Separate power bus for internal core logic and input buffers Core base cells containing N-channel and P-channel pairs, arranged in column of gates Isolated ...
Description	0.25m Sea of Gates and Customer Structured Arrays 0.25レm Sea of Gates and Customer Structured Arrays
File Size	122.73K / 22 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IDC08D120T6M
OCR Text	...mm 2 thickness 11 0 m wafer size 150 mm flat position 180 deg max. possible chips per wafer 2024 pcs passivation frontside p hotoimide pad metall 3200 nm al si cu backside metall ni ag ? system ...
Description	Diode EMCON 4 Medium Power Chip
File Size	113.43K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IDC05S60CE
OCR Text	... 1.68 mm 2 thickness 355 m wafer size 100 mm max. possible chips per wafer 4051 passivation frontside photoimide anode metal 3200 nm al cathode metal ni ag ?system suitable for epoxy and soft solder die bonding die bond ...
Description	2nd generation thinQ!TM SiC Schottky Diode
File Size	102.30K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IDC08S60CE
OCR Text	... 2.52 mm 2 thickness 355 m wafer size 100 mm max. possible chips per wafer 2682 passivation frontside photoimide anode metal 3200 nm al cathode metal ni ag ?system suitable for epoxy and soft solder die bonding die bond ...
Description	2nd generation thinQ!TM SiC Schottky Diode
File Size	101.50K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IDC08S120E
OCR Text	... 4.05 mm 2 thickness 362 m wafer size 100 mm max. possible chips per wafer 1652 passivation frontside photoimide pad metal 3200 nm al backside metal ni ag ?system suitable for epoxy and soft solder die bonding die bond ...
Description	1200V thinQ!TM SiC Schottky Diode
File Size	120.15K / 5 Page	View it Online	Download Datasheet

				Microsemi
Part No.	2N29071ADC 2N29071ADC-1
OCR Text	...IL-PRF-19500/291 n AVAILABLE IN wafer OR CHIP FORM FOR HYBRID APPLICATIONS n GENERAL PURPOSE-HIGH SPEED SWITCHING APPLICATIONS n LOW VCE(sat): .4V @ IC = 150 mAdc PHYSICAL DIMENSIONS Absolute Maximum Ratings: Symbol Vceo Vcbo Vebo Ic...
Description	SWITCHING TRANSISTOR PNP SILICON
File Size	44.89K / 3 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	OP467AY_883C
OCR Text	... performed on three independent wafer lots at 125 C, with an LTPD of 1.3. 2 For proper operation the positive supply must be sequenced ON before the negative supply. Specifications subject to change without notice. -2- REV. E OP467...
Description	Quad Precision High Speed Operational Amplifier
File Size	382.90K / 21 Page	View it Online	Download Datasheet

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