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B330K CX1102A 30015 GRM31CR 74LVC2 GBJ6K 25003 MEGA3
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    MACOM[Tyco Electronics]
Part No. AM52-0001TR AM52-0001 AM52-0001SMB
OCR Text ...fier. Cross Section View RF traces + Components RF Ground C2 DC Routing Customer Defined C11 C7 C3 0.47" (T1) C10 C6 C1 C4 0.25" (T2) C8 The PCB dielectric between RF traces and RF ground layers should be chosen to reduce...
Description 1.2 W High Efficiency Power Amplifier 800 - 960 MHz

File Size 78.74K  /  6 Page

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FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
Part No. AN-5026
OCR Text ... vias to the VCC/GND planes and traces under the BGA package. See Figure 8 for via placement. Pros: Better noise performance due to lower power inductance (shorter VCC/GND trace length). Cons: Via size under the package is restricted to 0.5...
Description Using BGA Packages
Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No

File Size 720.16K  /  8 Page

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    CYPRESS[Cypress Semiconductor]
Cypress Semiconductor Corp.
Part No. CY2510ZC-1 CY2509ZC-1 CY2510 CY2509
OCR Text ...FBOUT is equal in length to the traces between the outputs and the signal destinations, then the signals received at the destinations will be synchronized to the CLK signal input. Integrated Series Resistor Outputs: The frequency and phase ...
Description Spread Aware(TM), Ten/Eleven Output Zero Delay Buffer
Spread Aware, Ten/Eleven Output Zero Delay Buffer

File Size 99.90K  /  6 Page

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    CH1817LM CH1817 CH1817D CH1817-D CH1817DM CH1817-DM CH1817ET CH1817L CH1817-L CH1817LET CH1817-LM

Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
Part No. CH1817LM CH1817 CH1817D CH1817-D CH1817DM CH1817-DM CH1817ET CH1817L CH1817-L CH1817LET CH1817-LM
OCR Text ...or equivalent. 3. Circuit board traces from the DAA's TIP and RING pins must exceed 0.1 inch spacing from all other traces or other conducting material. The purpose for this pacing is to maintain 1000 VAC isolation between the phone line an...
Description Family of Low Profile DAA Modules DAA的超薄系列模

File Size 295.51K  /  7 Page

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    CH1837F CH1837A CH1838A

Cermetek microelectronics
ETC[ETC]
List of Unclassifed Manufacturers
Part No. CH1837F CH1837A CH1838A
OCR Text ...the two center pins. 3. All PCB traces from the CH1837A/7F/8A TIP and RING pins must be at least 0.1 inch spacing from all other traces or other conducting material. The purpose for this spacing is to maintain 1500 VC isolation between the ...
Description Data access arrangement module, V.34bis high speed DAA module
CH1837A/7F/8A Data Access Arrangement Module V.34bis High Speed DAA Module

File Size 199.63K  /  9 Page

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    RF2945

RFMD[RF Micro Devices]
Part No. RF2945
OCR Text ...ifier and Tx PA functions. Keep traces physically short and connect immediately to ground plane for best performance. RF input pin for the receiver electronics. RX IN input impedance is a low impedance when the transmitter is enabled. RX IN...
Description 433/868/915MHZ FSK/ASK/OOK TRANSCEIVER

File Size 741.21K  /  24 Page

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    ICS557GI-06LF ICS557GI-06LFT ICS557G-06 ICS557G-06LF ICS557G-06LFT ICS557G-06T ICS557-06

Integrated Device Technology
Part No. ICS557GI-06LF ICS557GI-06LFT ICS557G-06 ICS557G-06LF ICS557G-06LFT ICS557G-06T ICS557-06
OCR Text ...nted on the back). Other signal traces should be routed away from the ICS557-06. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. Load Resistors RL Since the clo...
Description 1 TO 4 HCSL CLOCK BUFFER

File Size 234.71K  /  11 Page

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