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| Part No. |
AN-9048
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| OCR Text |
...re a reliability risk or not. rework due to the high temperatures associated with lead free reflow, it is recommended that this component not be reused if rework becomes necessary. the 6x6 drmos should be removed from the pwb with h... |
| Description |
6x6 DriverMOS Packaging
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| File Size |
746.79K /
9 Page |
 View
it Online |
Download Datasheet
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http://
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| Part No. |
AN-9046
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| OCR Text |
...re a reliability risk or not. rework due to the high temperatures associated with lead free reflow, it is recommended that this component not be reused if rework becomes necessary. the dual power56 should be removed from the pwb wit... |
| Description |
Dual Power56 Packaging
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| File Size |
850.15K /
10 Page |
View
it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA2266
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should be subjected to no more than 15C above the solder melting temperature for no... |
| Description |
WCDMA Band I Power Amplifier Module
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| File Size |
189.22K /
7 Page |
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it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMPA1759
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| OCR Text |
... and be a consistent thickness. rework Considerations: rework of a device attached to a board is limited to reflow of the solder with a heat gun. The device should not be subjected to more than 225C and reflow solder in the molten state for... |
| Description |
3.4V Korean PCS CDMA PA Module
Korean-PCS PowerEdge Power Amplifier Module
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| File Size |
536.06K /
8 Page |
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it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9040
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| OCR Text |
...re a reliability risk or not. rework due to the high temperatures associated with lead free reflow, it is recommended that this component not be reused if rework becomes necessary. the power33 s hould be removed from the pwb with ho... |
| Description |
Power33 Packaging
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| File Size |
299.73K /
7 Page |
View
it Online |
Download Datasheet |
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http://
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| Part No. |
AN-9037
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| OCR Text |
...re a reliability risk or not. rework due to the high temperatures associated with lead free reflow, it is recommended that this component not be reused if rework becomes necessary. the mlp should be removed from the pwb with hot air... |
| Description |
8x8 MLP DriverMOS Packaging
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| File Size |
749.51K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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